{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,16]],"date-time":"2026-04-16T04:50:48Z","timestamp":1776315048865,"version":"3.50.1"},"reference-count":30,"publisher":"IEEE","license":[{"start":{"date-parts":[[2017,1,1]],"date-time":"2017-01-01T00:00:00Z","timestamp":1483228800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2017,1,1]],"date-time":"2017-01-01T00:00:00Z","timestamp":1483228800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,1]]},"DOI":"10.1109\/aspdac.2017.7858390","type":"proceedings-article","created":{"date-parts":[[2017,2,20]],"date-time":"2017-02-20T16:36:54Z","timestamp":1487608614000},"page":"605-610","source":"Crossref","is-referenced-by-count":24,"title":["Routing perturbation for enhanced security in split manufacturing"],"prefix":"10.1109","author":[{"given":"Yujie","family":"Wang","sequence":"first","affiliation":[{"name":"Department of Electrical & Computer Engineering, Texas A&M University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pu","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Electrical & Computer Engineering, Texas A&M University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiang","family":"Hu","sequence":"additional","affiliation":[{"name":"Department of Electrical & Computer Engineering, Texas A&M University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jeyavijayan J V","family":"Rajendran","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, The University of Texas at Dallas"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","article-title":"Trends in the global IC design service market","volume-title":"DIGITIMES Research","year":"2012"},{"key":"ref2","article-title":"Trusted Integrated Circuits Program","volume-title":"Intelligence Advanced Research Projects Activity","year":"2011"},{"key":"ref3","article-title":"Defense Science Board (DSB) study on High Performance Microchip Supply","volume-title":"DARPA","year":"2005"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2010.7"},{"key":"ref5","first-page":"333","article-title":"The state-of-the-art in semiconductor reverse engineering","volume-title":"IEEE\/ACM Design Automation Conference","author":"Torrance"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2332291"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2334493"},{"key":"ref8","article-title":"Innovation is at risk as semiconductor equipment and materials industry loses up to $4 billion annually due to IP infringement","volume-title":"SEMI","year":"2008"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.261"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2014.6855559"},{"key":"ref11","article-title":"Split manufacturing method for advanced semiconductor circuits","author":"Jarvis","year":"2004"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2014.6855561"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2013.6658536"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593123"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2015.7140237"},{"key":"ref16","article-title":"Stopping Hardware Trojans in Their Tracks","author":"Mitra","year":"2015"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.3390\/electronics4030541"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2014.6855560"},{"key":"ref19","first-page":"495","article-title":"Securing computer hardware using 3D integrated circuit (IC) technology and split manufacturing for obfuscation","volume-title":"USENIX Conference on Security","author":"Imeson"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/2808414.2808420"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2227257"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2015.7140229"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898104"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176634"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2335155"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1007\/b117406"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/800139.804528"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/54.785838"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/54.867894"},{"key":"ref30","article-title":"Berkeley Predictive Technology Model (PTM)"}],"event":{"name":"2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC)","location":"Chiba, Japan","start":{"date-parts":[[2017,1,16]]},"end":{"date-parts":[[2017,1,19]]}},"container-title":["2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7847727\/7858249\/07858390.pdf?arnumber=7858390","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,11]],"date-time":"2025-11-11T05:58:11Z","timestamp":1762840691000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7858390\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,1]]},"references-count":30,"URL":"https:\/\/doi.org\/10.1109\/aspdac.2017.7858390","relation":{},"subject":[],"published":{"date-parts":[[2017,1]]}}}