{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T23:06:13Z","timestamp":1747868773260,"version":"3.28.0"},"reference-count":23,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,1]]},"DOI":"10.1109\/aspdac.2018.8297314","type":"proceedings-article","created":{"date-parts":[[2018,2,22]],"date-time":"2018-02-22T17:02:02Z","timestamp":1519318922000},"page":"251-258","source":"Crossref","is-referenced-by-count":22,"title":["Concerted wire lifting: Enabling secure and cost-effective split manufacturing"],"prefix":"10.1109","author":[{"given":"Satwik","family":"Patnaik","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Johann","family":"Knechtel","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mohammed","family":"Ashraf","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ozgur","family":"Sinanoglu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","article-title":"Are proximity attacks a threat to the security of split manufacturing of integrated circuits?","volume":"pp","author":"maga\u00f1a","year":"2017","journal-title":"Trans VLSI Syst"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.7873\/DATE.2013.261"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1145\/2897937.2898104"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/ICCAD.2017.8203796"},{"year":"2017","journal-title":"DfX Lab NYUAD","key":"ref14"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1109\/ASPDAC.2017.7858390"},{"key":"ref16","first-page":"495","article-title":"Securing computer hardware using 3D integrated circuit (IC) technology and split manufacturing for obfuscation","author":"imeson","year":"2013","journal-title":"Proc USENIX Sec Symp"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/ASPDAC.2018.8297316"},{"key":"ref18","first-page":"1","article-title":"How secure is split manufacturing in preventing hardware trojan?","author":"chen","year":"2016","journal-title":"Proc AHOST"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/ICCAD.2017.8203758"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.3390\/electronics4030541"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/HST.2014.6855559"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1007\/978-3-319-49019-9_10"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/HST.2014.6855561"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1145\/3060403.3060588"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/HST.2015.7140229"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/CICC.2013.6658536"},{"key":"ref1","article-title":"Trusted integrated chips (TIC)","author":"mccants","year":"2011","journal-title":"Intelligence Advanced Research Projects Activity (IARPA) Tech Rep"},{"key":"ref9","first-page":"90: 1","article-title":"Are proximity attacks a threat to the security of split manufacturing of integrated circuits?","author":"maga\u00f1a","year":"2016","journal-title":"Proc ICCAD"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.1007\/978-90-481-9591-6"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1145\/1960397.1960429"},{"year":"2011","journal-title":"Nangate FreePDK45 Open Cell Library","key":"ref21"},{"doi-asserted-by":"publisher","key":"ref23","DOI":"10.1145\/2591513.2591540"}],"event":{"name":"2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)","start":{"date-parts":[[2018,1,22]]},"location":"Jeju","end":{"date-parts":[[2018,1,25]]}},"container-title":["2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8291862\/8297256\/08297314.pdf?arnumber=8297314","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,4,11]],"date-time":"2018-04-11T17:11:11Z","timestamp":1523466671000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8297314\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,1]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/aspdac.2018.8297314","relation":{},"subject":[],"published":{"date-parts":[[2018,1]]}}}