{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T06:48:36Z","timestamp":1729666116922,"version":"3.28.0"},"reference-count":29,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,1]]},"DOI":"10.1109\/aspdac.2018.8297392","type":"proceedings-article","created":{"date-parts":[[2018,2,22]],"date-time":"2018-02-22T22:02:02Z","timestamp":1519336922000},"page":"623-630","source":"Crossref","is-referenced-by-count":9,"title":["Accelerating electromigration aging for fast failure detection for nanometer ICs"],"prefix":"10.1109","author":[{"given":"Zeyu","family":"Sun","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheriff","family":"Sadiqbatcha","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hengyang","family":"Zhao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheldon X.-D.","family":"Tan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967083"},{"key":"ref11","first-page":"244","article-title":"Electromigration recovery modeling and analysis under time-depdendent current and temperature stressing","author":"huang","year":"2016","journal-title":"Proc Asia South Pacific Design Automation Conf (ASPDAC)"},{"key":"ref12","article-title":"Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing","author":"huang","year":"2016","journal-title":"Integration the VLSI Journal"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2666723"},{"key":"ref14","article-title":"Recent advances in EM and BTI induced reliability modeling, analysis and optimization","author":"tan","year":"2017","journal-title":"Integration the VLSI Journal"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1063\/1.2196114"},{"journal-title":"Reliability and Failure of Electronic Materials and Devices","year":"1998","author":"ohring","key":"ref16"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2010.01.007"},{"journal-title":"Electromigration of Damascene copper for IC interconnect","year":"2004","author":"meyer","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2012.2233201"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1063\/1.117521"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1969.16754"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593180"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2682925"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2013.6531951"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2523898"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001387"},{"key":"ref2","doi-asserted-by":"crossref","DOI":"10.1109\/IIRW.2017.8361202","article-title":"Electrified driving experience-expectations on automotive semiconductors","author":"stork","year":"2017","journal-title":"2017 IEEE International Integrated Reliability Workshop (IIRW)"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2524540"},{"journal-title":"International Technology Roadmap for Semiconductors (ITRS) Interconnect 2015 Edition","year":"2015","key":"ref1"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/IPFA.2008.4588207"},{"journal-title":"Effects of Scaling and Grain Structure on Electromigration Reliability of Cu Interconnects","year":"2010","author":"zhang","key":"ref22"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2004.1315327"},{"key":"ref24","volume":"8","author":"suo","year":"2003","journal-title":"Reliability of Interconnect Structures 8 of Comprehensive Structural Integrity"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD.2016.7520752"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1063\/1.354305"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1063\/1.2917065"}],"event":{"name":"2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)","start":{"date-parts":[[2018,1,22]]},"location":"Jeju","end":{"date-parts":[[2018,1,25]]}},"container-title":["2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8291862\/8297256\/08297392.pdf?arnumber=8297392","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,10,11]],"date-time":"2019-10-11T13:37:20Z","timestamp":1570801040000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8297392\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,1]]},"references-count":29,"URL":"https:\/\/doi.org\/10.1109\/aspdac.2018.8297392","relation":{},"subject":[],"published":{"date-parts":[[2018,1]]}}}