{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T23:02:17Z","timestamp":1725490937220},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,11]]},"DOI":"10.1109\/asscc.2014.7008874","type":"proceedings-article","created":{"date-parts":[[2015,1,20]],"date-time":"2015-01-20T02:48:18Z","timestamp":1421722098000},"page":"117-120","source":"Crossref","is-referenced-by-count":2,"title":["Semiconductor innovation into the next decade"],"prefix":"10.1109","author":[{"given":"Jack Y.-C.","family":"Sun","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Plenary Keynote TSMC Technology Symposium","year":"2013","author":"chang","key":"15"},{"key":"13","first-page":"10","author":"itonaga","year":"0","journal-title":"VLSI Tech Symp Tech Digest"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1016\/j.nantod.2011.02.001"},{"key":"11","first-page":"186","author":"liu","year":"2014","journal-title":"VLSI Tech Symp Tech Digest"},{"key":"12","first-page":"484","author":"sukegawa","year":"2013","journal-title":"ISSCC Tech Digest"},{"key":"3","first-page":"2t","author":"sun","year":"2013","journal-title":"VLSI Tech Symp Tech Digest"},{"key":"2","first-page":"18","author":"chang","year":"0","journal-title":"Foundry Future Challenges in the 21st Century"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.1998.658762"},{"key":"10","first-page":"1541","author":"yu","year":"2014","journal-title":"CICC Tech Digest"},{"key":"7","first-page":"131","author":"auth","year":"2012","journal-title":"VLSI Tech Symp Tech Digest"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1117\/1.JMM.11.3.033011"},{"key":"5","first-page":"156","author":"nallapati","year":"2014","journal-title":"VLSI Tech Symp Tech Digest"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1974.1050511"},{"key":"9","first-page":"522","author":"duriez","year":"2013","journal-title":"IEDM Tech Digest"},{"key":"8","first-page":"224","author":"wu","year":"2013","journal-title":"IEDM Tech Digest"}],"event":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2014,11,10]]},"location":"KaoHsiung, Taiwan","end":{"date-parts":[[2014,11,12]]}},"container-title":["2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6996072\/7008838\/07008874.pdf?arnumber=7008874","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T00:40:21Z","timestamp":1490316021000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7008874\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,11]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/asscc.2014.7008874","relation":{},"subject":[],"published":{"date-parts":[[2014,11]]}}}