{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T12:48:36Z","timestamp":1725540516025},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/asscc.2015.7387461","type":"proceedings-article","created":{"date-parts":[[2016,1,21]],"date-time":"2016-01-21T18:12:35Z","timestamp":1453399955000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Dedicated ICs for wearable body sound monitoring"],"prefix":"10.1109","author":[{"given":"Zhaoyang","family":"Weng","sequence":"first","affiliation":[]},{"given":"Shaoquan","family":"Gao","sequence":"additional","affiliation":[]},{"given":"Jingjing","family":"Dong","sequence":"additional","affiliation":[]},{"given":"Kai","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Hanjun","family":"Jiang","sequence":"additional","affiliation":[]},{"given":"Fule","family":"Li","sequence":"additional","affiliation":[]},{"given":"Zhihua","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Yanqing","family":"Ning","sequence":"additional","affiliation":[]},{"given":"Xinkai","family":"Chen","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"179","author":"razavi","year":"2011","journal-title":"RF Microelectronics"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.3390\/s120911734"},{"journal-title":"NORDIC Seminar","article-title":"nRF8001 preliminary product specification-bluetooth low energy","year":"2011","key":"ref6"},{"journal-title":"CC2540 2 4GHz Bluetooth&#x00AE; low energy System-on-Chip (Rev F)","year":"0","key":"ref5"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MWC.2005.1404569"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS.2013.6573633"}],"event":{"name":"2015 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2015,11,9]]},"location":"Xia'men, China","end":{"date-parts":[[2015,11,11]]}},"container-title":["2015 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7378179\/7387429\/07387461.pdf?arnumber=7387461","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T22:44:31Z","timestamp":1490395471000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7387461\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/asscc.2015.7387461","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}