{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,21]],"date-time":"2026-03-21T20:52:46Z","timestamp":1774126366626,"version":"3.50.1"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/asscc.2016.7844198","type":"proceedings-article","created":{"date-parts":[[2017,2,10]],"date-time":"2017-02-10T15:58:46Z","timestamp":1486742326000},"page":"313-316","source":"Crossref","is-referenced-by-count":14,"title":["A fine-resolution pulse-shrinking time-to-digital converter with completion detection utilizing built-in offset pulse"],"prefix":"10.1109","author":[{"given":"Tetsuya","family":"Iizuka","sequence":"first","affiliation":[]},{"given":"Takehisa","family":"Koga","sequence":"additional","affiliation":[]},{"given":"Toru","family":"Nakura","sequence":"additional","affiliation":[]},{"given":"Kunihiro","family":"Asada","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2012.2215737"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2047435"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2013.2296192"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2304656"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.876206"},{"key":"ref7","doi-asserted-by":"crossref","DOI":"10.1007\/978-90-481-8628-0","author":"henzler","year":"2010","journal-title":"Time-to-Digital Converters"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2040306"},{"key":"ref1","first-page":"198","article-title":"A 10.8-ps-time-resolution 256×512 Image Sensor with 2-Tap True-CS Lock-In Pixels for Fluorescence Lifetime Imaging","author":"seo","year":"2015","journal-title":"IEEE ISSCC Dig of Tech Papers"}],"event":{"name":"2016 IEEE Asian Solid-State Circuits Conference (A-SSCC)","location":"Toyama, Japan","start":{"date-parts":[[2016,11,7]]},"end":{"date-parts":[[2016,11,9]]}},"container-title":["2016 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7833314\/7844119\/07844198.pdf?arnumber=7844198","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,18]],"date-time":"2019-09-18T15:00:01Z","timestamp":1568818801000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7844198\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/asscc.2016.7844198","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}