{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T12:37:37Z","timestamp":1725799057027},"reference-count":13,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,11]]},"DOI":"10.1109\/asscc.2017.8240236","type":"proceedings-article","created":{"date-parts":[[2017,12,28]],"date-time":"2017-12-28T16:32:34Z","timestamp":1514478754000},"page":"141-144","source":"Crossref","is-referenced-by-count":4,"title":["A 12.1mW, 60dB SNR, 8-channel beamforming embedded SAR ADC for ultrasound imaging systems"],"prefix":"10.1109","author":[{"given":"Taehoon","family":"Kim","sequence":"first","affiliation":[]},{"given":"Suhwan","family":"Kim","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757499"},{"key":"ref11","first-page":"2185","article-title":"A Novel Beamforming Method for Wireless Ultrasound Smart Probe","author":"bae","year":"2014","journal-title":"IEEE Ultrason Symp"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2016.7905458"},{"key":"ref13","first-page":"386","article-title":"A 1.62 GS\/s time-interleaved SAR ADC with digital background mismatch calibration achieving interleaving spurs below 70 dBFS","author":"le dortz","year":"0"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2005.1509785"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/58.165556"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2012.2219532"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870458"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2015.2406780"},{"key":"ref7","first-page":"193","article-title":"A single-chip time-interleaved 32-channel analog beamformer for ultrasound medical imaging","author":"um","year":"2012","journal-title":"IEEE Asian Solid-State Circuits Conf"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2003.1293556"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.1998.765012"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2012.0561"}],"event":{"name":"2017 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2017,11,6]]},"location":"Seoul","end":{"date-parts":[[2017,11,8]]}},"container-title":["2017 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8226344\/8240197\/08240236.pdf?arnumber=8240236","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,2,5]],"date-time":"2018-02-05T17:34:47Z","timestamp":1517852087000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8240236\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,11]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/asscc.2017.8240236","relation":{},"subject":[],"published":{"date-parts":[[2017,11]]}}}