{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,23]],"date-time":"2026-04-23T20:55:32Z","timestamp":1776977732390,"version":"3.51.4"},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,12,16]],"date-time":"2025-12-16T00:00:00Z","timestamp":1765843200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,12,16]],"date-time":"2025-12-16T00:00:00Z","timestamp":1765843200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,12,16]]},"DOI":"10.1109\/ats66998.2025.00018","type":"proceedings-article","created":{"date-parts":[[2026,4,23]],"date-time":"2026-04-23T19:57:38Z","timestamp":1776974258000},"page":"55-60","source":"Crossref","is-referenced-by-count":0,"title":["LLM-Design Platform for Thermal-Failure-Aware 3D Chiplet Layout via Iterative Parameter Analysis"],"prefix":"10.1109","author":[{"given":"Tai","family":"Song","sequence":"first","affiliation":[{"name":"Anhui University,School of Integrated Circuits,Hefei,China"}],"role":[{"role":"author","vocab":"crossref"}]},{"given":"Senling","family":"Wang","sequence":"additional","affiliation":[{"name":"Ehime University,Graduate School of Sci. and Eng,Matsuyama,Japan"}],"role":[{"role":"author","vocab":"crossref"}]},{"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"Kyushu Institute of Technology,Fukuoka,Japan"}],"role":[{"role":"author","vocab":"crossref"}]}],"member":"263","event":{"name":"2025 IEEE 34th Asian Test Symposium (ATS)","location":"Tokyo, Japan","start":{"date-parts":[[2025,12,16]]},"end":{"date-parts":[[2025,12,19]]}},"container-title":["2025 IEEE 34th Asian Test Symposium (ATS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11487933\/11487969\/11488001.pdf?arnumber=11488001","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,23]],"date-time":"2026-04-23T19:57:40Z","timestamp":1776974260000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11488001\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,12,16]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/ats66998.2025.00018","relation":{},"subject":[],"published":{"date-parts":[[2025,12,16]]}}}