{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T19:14:37Z","timestamp":1754162077146,"version":"3.41.2"},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,11]]},"DOI":"10.1109\/bcicts45179.2019.8972778","type":"proceedings-article","created":{"date-parts":[[2020,1,31]],"date-time":"2020-01-31T00:16:05Z","timestamp":1580429765000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Monte Carlo Investigation of Traveling Accumulation Layers in InP Heterojunction Bipolar Transistor Power Amplifiers"],"prefix":"10.1109","author":[{"given":"Jonathan P.","family":"Sculley","sequence":"first","affiliation":[{"name":"Georgia Institute of Technology,Atlanta,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Brian","family":"Markman","sequence":"additional","affiliation":[{"name":"University of California,Santa Barbara,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Utku","family":"Soylu","sequence":"additional","affiliation":[{"name":"University of California,Santa Barbara,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yihao","family":"Fang","sequence":"additional","affiliation":[{"name":"University of California,Santa Barbara,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Miguel E.","family":"Urteaga","sequence":"additional","affiliation":[{"name":"Teledyne Scientific and Imaging,Thousand Oaks,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andy D.","family":"Carter","sequence":"additional","affiliation":[{"name":"Teledyne Scientific and Imaging,Thousand Oaks,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mark J. W.","family":"Rodwell","sequence":"additional","affiliation":[{"name":"University of California,Santa Barbara,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Paul D.","family":"Yoder","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology,Atlanta,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1149\/1.1506168"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1108\/eb010127"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/16.936504"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2001.966986"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2008.2005433"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2011.2164611"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1063\/1.323670"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1063\/1.361074"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1088\/0370-1328\/82\/6\/315"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1147\/rd.82.0141"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1049\/el:19940794"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1964.3476"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/55.817434"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1063\/1.113743"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2003.813908"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/16.753693"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2002.808150"}],"event":{"name":"2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)","start":{"date-parts":[[2019,11,3]]},"location":"Nashville, TN, USA","end":{"date-parts":[[2019,11,6]]}},"container-title":["2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8961327\/8972708\/08972778.pdf?arnumber=8972778","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,29]],"date-time":"2025-07-29T18:24:37Z","timestamp":1753813477000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8972778\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,11]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/bcicts45179.2019.8972778","relation":{},"subject":[],"published":{"date-parts":[[2019,11]]}}}