{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T13:43:55Z","timestamp":1750340635191},"reference-count":27,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,16]],"date-time":"2022-10-16T00:00:00Z","timestamp":1665878400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,16]],"date-time":"2022-10-16T00:00:00Z","timestamp":1665878400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,16]]},"DOI":"10.1109\/bcicts53451.2022.10051698","type":"proceedings-article","created":{"date-parts":[[2023,2,27]],"date-time":"2023-02-27T18:44:26Z","timestamp":1677523466000},"page":"9-16","source":"Crossref","is-referenced-by-count":4,"title":["High-Performance CMOS TIA for Data Center Optical Interconnects"],"prefix":"10.1109","author":[{"given":"Kadaba R.","family":"Lakshmikumar","sequence":"first","affiliation":[{"name":"Cisco Systems Inc.,Client Optics Group,Allentown,PA,USA"}]},{"given":"Alexander","family":"Kurylak","sequence":"additional","affiliation":[{"name":"Cisco Systems Inc.,Client Optics Group,Allentown,PA,USA"}]},{"given":"Romesh","family":"Kumar Nandwana","sequence":"additional","affiliation":[{"name":"Cisco Systems Inc.,Client Optics Group,Allentown,PA,USA"}]},{"given":"Bibhu","family":"Das","sequence":"additional","affiliation":[{"name":"Cisco Systems Inc.,Client Optics Group,Allentown,PA,USA"}]},{"given":"Joe","family":"Pampanin","sequence":"additional","affiliation":[{"name":"Cisco Systems Inc.,Client Optics Group,Allentown,PA,USA"}]},{"given":"Vito","family":"Boccuzzi","sequence":"additional","affiliation":[{"name":"Cisco Systems Inc.,Client Optics Group,Allentown,PA,USA"}]},{"given":"Pavan","family":"Kumar Hanumolu","sequence":"additional","affiliation":[{"name":"University of Illinois,Dept. of Electrical Engineering,Urbana-Champaign,IL,USA"}]}],"member":"263","reference":[{"year":"2020","key":"ref1","article-title":"Cisco Annual Internet Report, 2018\u20132023"},{"article-title":"The Amount of Data Center Energy Use","volume-title":"AKCP Monitoring","author":"Garcia","key":"ref2"},{"key":"ref3","article-title":"Cisco commits to net zero greenhouse gas emissions by 2040"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2018.8357007"},{"article-title":"private communication","year":"2022","author":"Hauenschild","key":"ref5"},{"article-title":"private communication","year":"2022","author":"Khoury","key":"ref6"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.884388"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1364\/ACP.2009.TuR3"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/HOTI.2009.18"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1364\/OE.26.013106"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2020.2967235"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2782080"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2022.3144985"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2021.3061535"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939652"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3110088"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CICC53496.2022.9772827"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2009.2037847"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2012.2206452"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2019.2899147"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2020.2990107"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1002\/9781119264422"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662495"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2018.8357076"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2041502"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2002.1015043"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3064248"}],"event":{"name":"2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","start":{"date-parts":[[2022,10,16]]},"location":"Phoenix, AZ, USA","end":{"date-parts":[[2022,10,19]]}},"container-title":["2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10051690\/10051691\/10051698.pdf?arnumber=10051698","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,13]],"date-time":"2024-02-13T18:36:53Z","timestamp":1707849413000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10051698\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,16]]},"references-count":27,"URL":"https:\/\/doi.org\/10.1109\/bcicts53451.2022.10051698","relation":{},"subject":[],"published":{"date-parts":[[2022,10,16]]}}}