{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,1]],"date-time":"2025-11-01T09:34:43Z","timestamp":1761989683902},"reference-count":33,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,10,16]],"date-time":"2022-10-16T00:00:00Z","timestamp":1665878400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,16]],"date-time":"2022-10-16T00:00:00Z","timestamp":1665878400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,10,16]]},"DOI":"10.1109\/bcicts53451.2022.10051763","type":"proceedings-article","created":{"date-parts":[[2023,2,27]],"date-time":"2023-02-27T18:44:26Z","timestamp":1677523466000},"source":"Crossref","is-referenced-by-count":7,"title":["InP\/GaAsSb DHBTs: THz Analog Performance and Record 180-Gb\/s 5.5V<sub>ppd<\/sub>-Swing PAM-4 DAC-Driver"],"prefix":"10.1109","author":[{"given":"C. R.","family":"Bolognesi","sequence":"first","affiliation":[{"name":"ETH-Z&#x00FC;rich,Millimeter-Wave Electronics Group (MWE)"}]},{"given":"A. M.","family":"Arabhavi","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich,Millimeter-Wave Electronics Group (MWE)"}]},{"given":"R.","family":"Hersent","sequence":"additional","affiliation":[{"name":"Thales Research and Technology and CEA-LETI,III-V Lab, Joint lab: Nokia Bell Labs,France"}]},{"given":"S.","family":"Hamzeloui","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich,Millimeter-Wave Electronics Group (MWE)"}]},{"given":"F.","family":"Jorge","sequence":"additional","affiliation":[{"name":"Thales Research and Technology and CEA-LETI,III-V Lab, Joint lab: Nokia Bell Labs,France"}]},{"given":"X.","family":"Wen","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich,Integrated Systems Laboratory (IIS)"}]},{"given":"M.","family":"Riet","sequence":"additional","affiliation":[{"name":"Thales Research and Technology and CEA-LETI,III-V Lab, Joint lab: Nokia Bell Labs,France"}]},{"given":"M.","family":"Luisier","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich,Integrated Systems Laboratory (IIS)"}]},{"given":"V.","family":"Nodjiadjim","sequence":"additional","affiliation":[{"name":"Thales Research and Technology and CEA-LETI,III-V Lab, Joint lab: Nokia Bell Labs,France"}]},{"given":"F.","family":"Ciabattini","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich,Millimeter-Wave Electronics Group (MWE)"}]},{"given":"C.","family":"Mismer","sequence":"additional","affiliation":[{"name":"Thales Research and Technology and CEA-LETI,III-V Lab, Joint lab: Nokia Bell Labs,France"}]},{"given":"O.","family":"Ostinelli","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich,Millimeter-Wave Electronics Group (MWE)"}]},{"given":"A.","family":"Konczykowska","sequence":"additional","affiliation":[{"name":"Thales Research and Technology and CEA-LETI,III-V Lab, Joint lab: Nokia Bell Labs,France"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2021.3138379"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/led.2020.2982497"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1063\/1.122594"},{"key":"ref5","first-page":"24","volume-title":"Full Report"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1063\/1.116088"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1063\/1.123428"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.116120"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/iciprm.2000.850276"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcrysgro.2004.04.035"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.4135\/9781452233253.n6"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/drc.2011.5994532"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/led.2015.2421311"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/led.2015.2407193"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/lmwc.2018.2871336"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.23919\/eumc.2019.8910876"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/22.780391"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/csics.2016.7751067"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1063\/1.3662152"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/cstic.2018.8369168"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/csics.2017.8240429"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2019.2946514"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/jeds.2019.2928271"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/bcicts50416.2021.9682463"},{"key":"ref25","article-title":"Over 70-GHz 4.9-Vppdiff InP linear driver for next generation coherent optical communications","volume-title":"2019 IEEE BCICT Symposium","author":"Hersent"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1049\/el.2020.0654"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/mwsym.2017.8058847"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/csics.2013.6659193"},{"key":"ref29","article-title":"A 6V swing 3.6% THD >40GHz driver with 4.5\u00d7 bandwidth extension for a 272 Gb\/s dual-polarization 16-QAM silicon photonic transmitter","volume-title":"2019 IEEE ISSC Proc","author":"Abdelrahman"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/jlt.2017.2760507"},{"key":"ref31","doi-asserted-by":"crossref","DOI":"10.1364\/OFC.2016.Th3A.2","article-title":"Single carrier high symbol rate transmitter for data rates up to 1.0 Tb\/s","volume-title":"Optical Fiber Communication Conference. Optical Society of America","author":"Raybon"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.23919\/MIKON54314.2022.9924653"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/bcicts.2018.8550977"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2016.7838335"}],"event":{"name":"2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","location":"Phoenix, AZ, USA","start":{"date-parts":[[2022,10,16]]},"end":{"date-parts":[[2022,10,19]]}},"container-title":["2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10051690\/10051691\/10051763.pdf?arnumber=10051763","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,13]],"date-time":"2024-02-13T18:41:25Z","timestamp":1707849685000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10051763\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,16]]},"references-count":33,"URL":"https:\/\/doi.org\/10.1109\/bcicts53451.2022.10051763","relation":{},"subject":[],"published":{"date-parts":[[2022,10,16]]}}}