{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,6]],"date-time":"2026-06-06T17:07:43Z","timestamp":1780765663082,"version":"3.54.1"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,27]],"date-time":"2024-10-27T00:00:00Z","timestamp":1729987200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,27]],"date-time":"2024-10-27T00:00:00Z","timestamp":1729987200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,27]]},"DOI":"10.1109\/bcicts59662.2024.10745685","type":"proceedings-article","created":{"date-parts":[[2024,11,12]],"date-time":"2024-11-12T18:35:38Z","timestamp":1731436538000},"page":"162-165","source":"Crossref","is-referenced-by-count":16,"title":["300-GHz 160-Gb\/s InP-HEMT Wireless Front-End With Fully Differential Architecture"],"prefix":"10.1109","author":[{"given":"Hiroshi","family":"Hamada","sequence":"first","affiliation":[{"name":"NTT Corporation,NTT Device Technology Labs"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ibrahim","family":"Abdo","sequence":"additional","affiliation":[{"name":"NTT Corporation,NTT Device Technology Labs"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Takuya","family":"Tsutsumi","sequence":"additional","affiliation":[{"name":"Osaka Metropolitan University,Department of Physics and Electronics"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hiroyuki","family":"Takahashi","sequence":"additional","affiliation":[{"name":"NTT Corporation,NTT Device Technology Labs"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3005818"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2019.2953647"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1587\/elex.18.20210314"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439850"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3327478"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3061662"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2928849"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/iedm19573.2019.8993540"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2944855"}],"event":{"name":"2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","location":"Fort Lauderdale, FL, USA","start":{"date-parts":[[2024,10,27]]},"end":{"date-parts":[[2024,10,30]]}},"container-title":["2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10745638\/10745653\/10745685.pdf?arnumber=10745685","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T15:44:02Z","timestamp":1732722242000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10745685\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,27]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/bcicts59662.2024.10745685","relation":{},"subject":[],"published":{"date-parts":[[2024,10,27]]}}}