{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T03:28:27Z","timestamp":1769916507248,"version":"3.49.0"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,27]],"date-time":"2024-10-27T00:00:00Z","timestamp":1729987200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,27]],"date-time":"2024-10-27T00:00:00Z","timestamp":1729987200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,27]]},"DOI":"10.1109\/bcicts59662.2024.10745706","type":"proceedings-article","created":{"date-parts":[[2024,11,12]],"date-time":"2024-11-12T18:35:38Z","timestamp":1731436538000},"page":"84-87","source":"Crossref","is-referenced-by-count":2,"title":["High-Temperature Stability Base Ohmic Contacts for InP\/GaAsSb DHBTs"],"prefix":"10.1109","author":[{"given":"F.","family":"Ciabattini","sequence":"first","affiliation":[{"name":"ETH-Z&#x00FC;rich Gloriastrasse 35, 8092,Millimeter-Wave Electronics (MWE) Group,Z&#x00FC;rich,Switzerland"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A. M.","family":"Arabhavi","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich Gloriastrasse 35, 8092,Millimeter-Wave Electronics (MWE) Group,Z&#x00FC;rich,Switzerland"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Hamzeloui","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich Gloriastrasse 35, 8092,Millimeter-Wave Electronics (MWE) Group,Z&#x00FC;rich,Switzerland"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Bonomo","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich Gloriastrasse 35, 8092,Millimeter-Wave Electronics (MWE) Group,Z&#x00FC;rich,Switzerland"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Ebrahimi","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich Gloriastrasse 35, 8092,Millimeter-Wave Electronics (MWE) Group,Z&#x00FC;rich,Switzerland"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"O.","family":"Ostinelli","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich Gloriastrasse 35, 8092,Millimeter-Wave Electronics (MWE) Group,Z&#x00FC;rich,Switzerland"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C. R.","family":"Bolognesi","sequence":"additional","affiliation":[{"name":"ETH-Z&#x00FC;rich Gloriastrasse 35, 8092,Millimeter-Wave Electronics (MWE) Group,Z&#x00FC;rich,Switzerland"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2021.3138379"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/BCICTS53451.2022.10051732"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.23919\/EuMIC54520.2022.9923471"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/BCICTS54660.2023.10310957"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/BCICTS54660.2023.10310928"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/16.960389"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2019.111017"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.4826205"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1149\/1.2712831"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1116\/1.5133863"},{"key":"ref11","article-title":"Development of high-speed InP\/GaAsSb DHBTs and their application in Monolithic Microwave Integrated Circuits","author":"Quan","year":"2020"}],"event":{"name":"2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","location":"Fort Lauderdale, FL, USA","start":{"date-parts":[[2024,10,27]]},"end":{"date-parts":[[2024,10,30]]}},"container-title":["2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10745638\/10745653\/10745706.pdf?arnumber=10745706","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T07:28:12Z","timestamp":1732692492000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10745706\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,27]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/bcicts59662.2024.10745706","relation":{},"subject":[],"published":{"date-parts":[[2024,10,27]]}}}