{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T03:34:53Z","timestamp":1725593693800},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/biocas.2019.8919203","type":"proceedings-article","created":{"date-parts":[[2019,12,6]],"date-time":"2019-12-06T07:01:08Z","timestamp":1575615668000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants"],"prefix":"10.1109","author":[{"given":"Omer Can","family":"Akgun","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kambiz","family":"Nanbakhsh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vasiliki","family":"Giagka","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wouter A.","family":"Serdijn","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/s10544-015-0011-5"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1186\/s42234-018-0010-y"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1117\/12.426982"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1088\/1741-2560\/10\/3\/031002"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2018.8357047"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/BIOCAS.2018.8584761"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2715837"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201806440"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2019.8702667"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1142\/9789812561763_0016"}],"event":{"name":"2019 IEEE Biomedical Circuits and Systems Conference (BioCAS)","start":{"date-parts":[[2019,10,17]]},"location":"Nara, Japan","end":{"date-parts":[[2019,10,19]]}},"container-title":["2019 IEEE Biomedical Circuits and Systems Conference (BioCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8910168\/8918681\/08919203.pdf?arnumber=8919203","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T21:53:01Z","timestamp":1658094781000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8919203\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/biocas.2019.8919203","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}