{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,15]],"date-time":"2025-12-15T19:28:15Z","timestamp":1765826895615},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,8]]},"DOI":"10.1109\/cadcg.2009.5246852","type":"proceedings-article","created":{"date-parts":[[2009,9,21]],"date-time":"2009-09-21T12:01:42Z","timestamp":1253534502000},"page":"497-502","source":"Crossref","is-referenced-by-count":5,"title":["A thermal-driven force-directed floorplanning algorithm for 3D ICs"],"prefix":"10.1109","author":[{"given":"Yun","family":"Huang","sequence":"first","affiliation":[]},{"given":"Qiang","family":"Zhou","sequence":"additional","affiliation":[]},{"given":"Yici","family":"Cai","sequence":"additional","affiliation":[]},{"given":"Haixia","family":"Yan","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2006.1594700"},{"journal-title":"Pattern Classification","year":"2003","author":"duda","key":"13"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2006.243742"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2006.243773"},{"journal-title":"Research On 3D Force-Directed Floorplannning Algorithm","year":"2007","author":"zhou","key":"12"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2006.883857"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.77"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2004.1382591"},{"year":"0","key":"10"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCCAS.2006.285165"},{"key":"6","article-title":"3d-staf:scalable temperature and leakage aware floorplanning for three- dimensional integrated circuits","author":"zhou","year":"2007","journal-title":"Int Conf Computer-Aided Design"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2003.1257591"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2004.1337555"},{"key":"9","article-title":"hierarchical randomwalk algorithms for power grid analysis","author":"qian","year":"2004","journal-title":"Proc Asia and South Pacific Design Automation Conf"},{"key":"8","first-page":"24","article-title":"compact thermal modeling analysis for 3d integration circuits","author":"wilkerson","year":"2004","journal-title":"Proc Int Conf Mixed Design of Integrated Circuits and System"}],"event":{"name":"2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics (CAD\/Graphics)","start":{"date-parts":[[2009,8,19]]},"location":"Huangshan, China","end":{"date-parts":[[2009,8,21]]}},"container-title":["2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5234369\/5246805\/05246852.pdf?arnumber=5246852","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T13:47:03Z","timestamp":1489758423000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5246852\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,8]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/cadcg.2009.5246852","relation":{},"subject":[],"published":{"date-parts":[[2009,8]]}}}