{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T15:58:15Z","timestamp":1759334295428,"version":"build-2065373602"},"reference-count":28,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,8,17]],"date-time":"2025-08-17T00:00:00Z","timestamp":1755388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,8,17]],"date-time":"2025-08-17T00:00:00Z","timestamp":1755388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000915","name":"Richard King Mellon Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000915","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,8,17]]},"DOI":"10.1109\/case58245.2025.11163901","type":"proceedings-article","created":{"date-parts":[[2025,9,23]],"date-time":"2025-09-23T17:24:07Z","timestamp":1758648247000},"page":"1403-1410","source":"Crossref","is-referenced-by-count":0,"title":["From Flat to Form-Fitting: A Computational Geometry Approach to 3D Conformal Electronics Design and Rapid Prototyping"],"prefix":"10.1109","author":[{"given":"Lehong","family":"Wang","sequence":"first","affiliation":[{"name":"Carnegie Mellon University,Department of Mechanical Engineering,Pittsburgh,PA,USA,15213"}]},{"given":"Zilin","family":"Dai","sequence":"additional","affiliation":[{"name":"Harvard University,John A. Paulson School of Engineering and Applied Sciences,Cambridge,MA,USA,02138"}]},{"given":"Yuchen","family":"Wu","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,Department of Mechanical Engineering,Pittsburgh,PA,USA,15213"}]},{"given":"Ye","family":"Jin","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,Department of Mechanical Engineering,Pittsburgh,PA,USA,15213"}]},{"given":"Colm","family":"Barry","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,Department of Mechanical Engineering,Pittsburgh,PA,USA,15213"}]},{"given":"Tina","family":"Tian","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,The Robotics Institute,Pittsburgh,PA,USA,15213"}]},{"given":"Fujun","family":"Ruan","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,Department of Mechanical Engineering,Pittsburgh,PA,USA,15213"}]},{"given":"Shricharan","family":"Shastry","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,The Robotics Institute,Pittsburgh,PA,USA,15213"}]},{"given":"Rahul","family":"Panat","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,Department of Mechanical Engineering,Pittsburgh,PA,USA,15213"}]},{"given":"Gary K.","family":"Fedder","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,Department of Electrical and Computer Engineering,Pittsburgh,PA,USA,15213"}]},{"given":"Howie","family":"Choset","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,The Robotics Institute,Pittsburgh,PA,USA,15213"}]},{"given":"Lu","family":"Li","sequence":"additional","affiliation":[{"name":"Carnegie Mellon University,The Robotics Institute,Pittsburgh,PA,USA,15213"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-022-09579-7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2024.3354372"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/adma.202004425"},{"key":"ref4","doi-asserted-by":"crossref","DOI":"10.2139\/ssrn.4655384","article-title":"High-resolution 3d curved circuits fabricated by electric-field-driven conformal micro-3d printing","author":"Li","year":"2023"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1002\/admt.202000093"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.mattod.2022.06.007"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.0c04857"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1038\/ncomms4329"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/flm2.35"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1002\/admt.202000093"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/FIIW.2012.6378343"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.pmatsci.2022.100945"},{"year":"2024","key":"ref13","article-title":"Altium designer: True 3d circuit design"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1088\/2058-8585\/ac28f1"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.3390\/mi15070920"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.4c21081"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.3390\/app11167509"},{"volume-title":"Conformal mapping","year":"2012","author":"Nehari","key":"ref18"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1111\/j.1467-8659.2008.01290.x"},{"key":"ref20","article-title":"Electrically Conductive Composite PLA"},{"year":"2021","key":"ref21","article-title":"NanoJet FS System"},{"key":"ref22","article-title":"JS-A554 Silver Nanoparticle Ink"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1111\/ffe.12631"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1097\/01.HJ.0000293278.53653.ac"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.12669\/pjms.303.4742"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1111\/j.1365-2273.2004.00950.x"},{"article-title":"In-ear hearing aid","volume-title":"licensed for use under TurboSquid\u2019s standard royalty-free license","year":"2020","key":"ref27"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1080\/15421406.2012.703817"}],"event":{"name":"2025 IEEE 21st International Conference on Automation Science and Engineering (CASE)","start":{"date-parts":[[2025,8,17]]},"location":"Los Angeles, CA, USA","end":{"date-parts":[[2025,8,21]]}},"container-title":["2025 IEEE 21st International Conference on Automation Science and Engineering (CASE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11163731\/11163732\/11163901.pdf?arnumber=11163901","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,30]],"date-time":"2025-09-30T15:30:01Z","timestamp":1759246201000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11163901\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,8,17]]},"references-count":28,"URL":"https:\/\/doi.org\/10.1109\/case58245.2025.11163901","relation":{},"subject":[],"published":{"date-parts":[[2025,8,17]]}}}