{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T10:36:34Z","timestamp":1725446194198},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,5]]},"DOI":"10.1109\/ccece.2018.8447758","type":"proceedings-article","created":{"date-parts":[[2018,8,30]],"date-time":"2018-08-30T17:54:56Z","timestamp":1535651696000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Thermal Effects Analysis of GaN HEMT Power Amplifier Based on LTCC Substrate Integration"],"prefix":"10.1109","author":[{"given":"Chokri","family":"Jebali","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ammar","family":"Kouki","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2424695"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2016.2514441"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2004.10.030"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2016.7893117"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2016.2603525"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2017.7992627"}],"event":{"name":"2018 IEEE Canadian Conference on Electrical & Computer Engineering (CCECE)","start":{"date-parts":[[2018,5,13]]},"location":"Quebec, QC, Canada","end":{"date-parts":[[2018,5,16]]}},"container-title":["2018 IEEE Canadian Conference on Electrical & Computer Engineering (CCECE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8426058\/8447529\/08447758.pdf?arnumber=8447758","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T08:12:26Z","timestamp":1643184746000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8447758\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,5]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/ccece.2018.8447758","relation":{},"subject":[],"published":{"date-parts":[[2018,5]]}}}