{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T23:01:35Z","timestamp":1725577295359},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,9,12]],"date-time":"2021-09-12T00:00:00Z","timestamp":1631404800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,9,12]],"date-time":"2021-09-12T00:00:00Z","timestamp":1631404800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,9,12]],"date-time":"2021-09-12T00:00:00Z","timestamp":1631404800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,9,12]]},"DOI":"10.1109\/ccece53047.2021.9569128","type":"proceedings-article","created":{"date-parts":[[2021,10,26]],"date-time":"2021-10-26T21:13:38Z","timestamp":1635282818000},"page":"1-8","source":"Crossref","is-referenced-by-count":0,"title":["CCECE 2021 Invited Paper: Holistic Performance, Reliability and Thermal Understanding of HPC Real Utilization on Silicon Architecture"],"prefix":"10.1109","author":[{"given":"Gamal","family":"Refai-Ahmed","sequence":"first","affiliation":[]},{"given":"Hoa","family":"Do","sequence":"additional","affiliation":[]},{"given":"I-Ru","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Jae-Gyung","family":"Ahn","sequence":"additional","affiliation":[]},{"given":"Huayan","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Xin","family":"Wu","sequence":"additional","affiliation":[]},{"given":"Suresh","family":"Ramalingam","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","article-title":"ESTABLISHING THERMAL AIR-COOLED LIMIT for High Performance Electronics Devices","author":"refai-ahmed","year":"2020","journal-title":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) EPTC"},{"journal-title":"A Versal Architecture and Product Data Sheet Overview (DS950","year":"2021","key":"ref3"},{"journal-title":"(19 0 8)","year":"0","author":"redhawk","key":"ref6"},{"journal-title":"(19 1 2)","year":"0","author":"totem","key":"ref5"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2019.8720594"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2017.7936278"},{"year":"0","key":"ref2"},{"journal-title":"Ansys Inc Icepack","year":"2021","key":"ref9"},{"key":"ref1","article-title":"Past, Present and Future Challenges of Electronics Packaging","author":"refai-ahmed","year":"2010","journal-title":"Calvin Lecture award IMECE ASME"}],"event":{"name":"2021 IEEE Canadian Conference on Electrical and Computer Engineering (CCECE)","start":{"date-parts":[[2021,9,12]]},"location":"ON, Canada","end":{"date-parts":[[2021,9,17]]}},"container-title":["2021 IEEE Canadian Conference on Electrical and Computer Engineering (CCECE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9569025\/9569028\/09569128.pdf?arnumber=9569128","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T16:53:32Z","timestamp":1652201612000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9569128\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,9,12]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/ccece53047.2021.9569128","relation":{},"subject":[],"published":{"date-parts":[[2021,9,12]]}}}