{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T12:14:44Z","timestamp":1730204084048,"version":"3.28.0"},"reference-count":23,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,1]]},"DOI":"10.1109\/ccwc.2017.7868424","type":"proceedings-article","created":{"date-parts":[[2017,3,2]],"date-time":"2017-03-02T21:39:33Z","timestamp":1488490773000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Clock signal characterization for signal integrity"],"prefix":"10.1109","author":[{"given":"Ahmed","family":"Saeed","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alaa E.","family":"El-Rouby","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.","family":"Ismail","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Ragai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.1999.777236"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1002\/cta.704"},{"key":"ref12","article-title":"Stratix III Device Handbook","volume":"1","year":"2014","journal-title":"Altera Corporation"},{"journal-title":"Micron Technology Inc","article-title":"DDR3 SDRAM Features, MT41J128M16JT- datasheet, April 2013","year":"2014","key":"ref13"},{"key":"ref14","article-title":"External Memory Interface Handbook","volume":"1","year":"0","journal-title":"Altera (2016 May)"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.800459"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2008.920649"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSE.2004.1490434"},{"key":"ref18","first-page":"879","article-title":"Overshoot and undershoot control for transmission line interconnects","author":"lee","year":"1999","journal-title":"Proc 49th Electronic Components and Technology Conf"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4615-1685-9"},{"article-title":"Signal and Power Integrity - Simplified","year":"2010","author":"bogatin","key":"ref4"},{"journal-title":"White Paper","article-title":"Basic Principles of Signal Integrity","year":"2007","key":"ref3"},{"key":"ref6","first-page":"673681","article-title":"A frequency-domain approach to interconnect crosstalk simulation and minimization","volume":"44","author":"rayas-snchez","year":"2004","journal-title":"Microelectronics Reliability"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCES.2010.5674881"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPWRD.2009.2037152"},{"article-title":"Signal Integrity Analysis and Simulation Tools Include IBIS Models","year":"0","author":"olah","key":"ref7"},{"article-title":"Digital Systems Engineering. Cambridge","year":"2000","author":"dally","key":"ref2"},{"journal-title":"Tech Report","article-title":"The International Technology Roadmap for Semiconductors","year":"2011","key":"ref1"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/96.338715"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2002.808445"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/5.929649"},{"year":"0","key":"ref21","first-page":"100"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.800459"}],"event":{"name":"2017 IEEE 7th Annual Computing and Communication Workshop and Conference (CCWC)","start":{"date-parts":[[2017,1,9]]},"location":"Las Vegas, NV, USA","end":{"date-parts":[[2017,1,11]]}},"container-title":["2017 IEEE 7th Annual Computing and Communication Workshop and Conference (CCWC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7864800\/7868337\/07868424.pdf?arnumber=7868424","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,11]],"date-time":"2017-03-11T02:36:23Z","timestamp":1489199783000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7868424\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,1]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/ccwc.2017.7868424","relation":{},"subject":[],"published":{"date-parts":[[2017,1]]}}}