{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,27]],"date-time":"2026-03-27T20:56:55Z","timestamp":1774645015683,"version":"3.50.1"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,1,1]],"date-time":"2019-01-01T00:00:00Z","timestamp":1546300800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,1,1]],"date-time":"2019-01-01T00:00:00Z","timestamp":1546300800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,1,1]],"date-time":"2019-01-01T00:00:00Z","timestamp":1546300800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,1]]},"DOI":"10.1109\/ccwc.2019.8666503","type":"proceedings-article","created":{"date-parts":[[2019,3,18]],"date-time":"2019-03-18T19:58:55Z","timestamp":1552939135000},"page":"0247-0251","source":"Crossref","is-referenced-by-count":21,"title":["AI on edge device for laser chip defect detection"],"prefix":"10.1109","author":[{"given":"Dennis","family":"Hou","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tuo","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yen-Ting","family":"Pan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Janpu","family":"Hou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1177\/1687814018766682"},{"key":"ref11","doi-asserted-by":"crossref","DOI":"10.1007\/s00170-018-1894-0","article-title":"Automated defect inspection of LED chip using deep convolutional neural network","author":"lin","year":"2018","journal-title":"Journal of Intelligent Manufacturing"},{"key":"ref12","author":"sheet","year":"0","journal-title":"Transfer Learning a GoogLeNet"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICAwST.2018.8517177"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/INFRKM.2018.8464769"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISKE.2017.8258820"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/CCET.2018.8542189"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CVPRW.2018.00219"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/MOCAST.2018.8376630"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ETFA.2018.8502480"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IJCNN.2006.247284"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.cor.2014.05.008"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2017.2787550"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CCWC.2017.7868455"},{"key":"ref7","first-page":"912","article-title":"Wafer defect patterns recognition based on Ordering Point to Identify the Cluster Structure and multi-label classification","author":"fan","year":"2016","journal-title":"2016 IEEE Advanced Information Management Communicates Electronic and Automation Control Conference (IMCEC)"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICPR.2014.12"},{"key":"ref1","article-title":"Evaluation of Interactive Machine Learning Systems","author":"boukhelifa","year":"2018","journal-title":"Learning in humans and machines"},{"key":"ref9","article-title":"Reliability, Failure Modes, and Degradation Mechanisms in High Power Single- and Multi-Mode InGaAs-AlGaAs Strained Quantum Well Lasers","author":"sin","year":"2016","journal-title":"Proceedings of SPIE - The International Society for Optical Engineering"}],"event":{"name":"2019 IEEE 9th Annual Computing and Communication Workshop and Conference (CCWC)","location":"Las Vegas, NV, USA","start":{"date-parts":[[2019,1,7]]},"end":{"date-parts":[[2019,1,9]]}},"container-title":["2019 IEEE 9th Annual Computing and Communication Workshop and Conference (CCWC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8663971\/8666184\/08666503.pdf?arnumber=8666503","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T17:52:01Z","timestamp":1658080321000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8666503\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,1]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/ccwc.2019.8666503","relation":{},"subject":[],"published":{"date-parts":[[2019,1]]}}}