{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T01:20:15Z","timestamp":1729646415269,"version":"3.28.0"},"reference-count":16,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/cec.2003.1299752","type":"proceedings-article","created":{"date-parts":[[2004,7,9]],"date-time":"2004-07-09T09:50:57Z","timestamp":1089366657000},"page":"823-829","source":"Crossref","is-referenced-by-count":2,"title":["DIWA: device independent wafermap analysis"],"prefix":"10.1109","volume":"2","author":[{"given":"E.","family":"Miguelanez","sequence":"first","affiliation":[]},{"given":"A.M.S.","family":"Zalzala","sequence":"additional","affiliation":[]},{"given":"P.","family":"Tabor","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/66.857947"},{"key":"16","doi-asserted-by":"crossref","DOI":"10.1117\/12.350840","article-title":"The application of spatial signature analysis to electrical test data: Validation study","author":"karnowski","year":"1999","journal-title":"SPIE's 24th Annual International Symposium on Metrology Inspection and Process Control for Microlithography XIII"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9780511812651"},{"key":"14","doi-asserted-by":"crossref","first-page":"3505","DOI":"10.1109\/IJCNN.1999.836231","article-title":"Semiconductor defect classification using hyperellipsoid clustering neural networks and model switching","volume":"5","author":"kameyana","year":"1999","journal-title":"International Joint Conference on Neural Networks"},{"journal-title":"Neural Network for Pattern Recognition","year":"1995","author":"bishop","key":"11"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1002\/j.1538-7305.1962.tb02426.x"},{"journal-title":"The National Technology Roadmap for Semiconductors","year":"2001","key":"3"},{"key":"2","article-title":"Automated analysis for rapid defect sourcing and yield learning","volume":"4","author":"tobin","year":"1997","journal-title":"Future Fab International"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/PGEC.1965.264137"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2006.884600"},{"key":"7","first-page":"2460","article-title":"Genetic algortihms for clustering, feature seletion and classification","volume":"4","author":"tseng","year":"0","journal-title":"International Conference on Neural Networks"},{"key":"6","doi-asserted-by":"crossref","first-page":"179","DOI":"10.1109\/TIT.1962.1057692","article-title":"Visual pattern recognition by moments invariants","volume":"8","author":"hu","year":"1962","journal-title":"IRE Transanctions on Information Theory"},{"key":"5","first-page":"115","author":"papoulis","year":"1991","journal-title":"Probability random variables and stochastic processes"},{"key":"4","first-page":"469","author":"lim","year":"1990","journal-title":"Two-Dimensional Signal and Image Processing"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ICEC.1997.592369"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TAI.1992.246402"}],"event":{"name":"The 2003 Congress on Evolutionary Computation, 2003. CEC '03.","location":"Canberra, Australia"},"container-title":["The 2003 Congress on Evolutionary Computation, 2003. CEC '03."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/9096\/28877\/01299752.pdf?arnumber=1299752","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,16]],"date-time":"2017-06-16T08:41:52Z","timestamp":1497602512000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1299752\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/cec.2003.1299752","relation":{},"subject":[]}}