{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T12:52:02Z","timestamp":1730206322923,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/cicc.2002.1012885","type":"proceedings-article","created":{"date-parts":[[2003,6,25]],"date-time":"2003-06-25T17:52:33Z","timestamp":1056563553000},"page":"491-494","source":"Crossref","is-referenced-by-count":2,"title":["Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection"],"prefix":"10.1109","author":[{"given":"M.S.","family":"Bakir","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.A.","family":"Reed","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.V.","family":"Mule","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.A.","family":"Kohl","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.P.","family":"Martin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.D.","family":"Meindl","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"280","article-title":"Sea of Leads: A disruptive paradigm for a system-on-a-chip","author":"naeemi","year":"2001","journal-title":"IEEE Int Solid-State Circuits Conf"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2000.853255"},{"key":"ref6","first-page":"1223","article-title":"Design fabrication, and performance of preferential-order volume grating waveguide counlers","volume":"39","author":"schultz","year":"2000","journal-title":"AppliedOptics"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2001.930037"},{"key":"ref2","first-page":"335","article-title":"Low cost high-density compliant wafer-level package","author":"patel","year":"2000","journal-title":"IEEE Int Conf on High-Density Interconnect and Systems Packaging"},{"journal-title":"The International Technology Roadmap for Semiconductors (ITRS)","year":"1999","key":"ref1"}],"event":{"name":"IEEE 2002 Custom Integrated Circuits Conference","acronym":"CICC-02","location":"Orlando, FL, USA"},"container-title":["Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/7911\/21814\/01012885.pdf?arnumber=1012885","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,10]],"date-time":"2017-03-10T20:18:47Z","timestamp":1489177127000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1012885\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/cicc.2002.1012885","relation":{},"subject":[]}}