{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T12:52:30Z","timestamp":1730206350461,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/cicc.2003.1249455","type":"proceedings-article","created":{"date-parts":[[2004,2,3]],"date-time":"2004-02-03T14:24:01Z","timestamp":1075818241000},"page":"537-540","source":"Crossref","is-referenced-by-count":0,"title":["Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology"],"prefix":"10.1109","author":[{"given":"X.","family":"Huo","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Guo-Wei Xiao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.J.","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.C.H.","family":"Chan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/16.824729"},{"key":"ref3","first-page":"88","article-title":"Rf-System-On-Package (SOP) for Wireless Communications","author":"lim","year":"2002","journal-title":"IEEE Microwave Mag"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1966.4682"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2002.802652"},{"key":"ref8","first-page":"794","article-title":"On the design of low-noise voltage-controlled oscillators using enhanced LC-tanks","volume":"42","author":"craninckx","year":"1995","journal-title":"IEEE CAS-II"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/6144.974961"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/4.568846"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/4.58301"}],"event":{"name":"CICC Custom Integrated Circuits Conference","acronym":"CICC-03","location":"San Jose, CA, USA"},"container-title":["Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8830\/27953\/01249455.pdf?arnumber=1249455","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,13]],"date-time":"2017-03-13T14:58:43Z","timestamp":1489417123000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1249455\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/cicc.2003.1249455","relation":{},"subject":[]}}