{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T19:41:35Z","timestamp":1725392495029},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/cicc.2005.1568618","type":"proceedings-article","created":{"date-parts":[[2006,1,18]],"date-time":"2006-01-18T18:42:54Z","timestamp":1137609774000},"page":"100-103","source":"Crossref","is-referenced-by-count":15,"title":["A 0.14mW\/Gbps high-density capacitive interface for 3D system integration"],"prefix":"10.1109","author":[{"given":"A.","family":"Fazzi","sequence":"first","affiliation":[]},{"given":"L.","family":"Magagni","sequence":"additional","affiliation":[]},{"given":"M.","family":"Mirandola","sequence":"additional","affiliation":[]},{"given":"R.","family":"Canegallo","sequence":"additional","affiliation":[]},{"given":"S.","family":"Schmitz","sequence":"additional","affiliation":[]},{"given":"R.","family":"Guerrieri","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","first-page":"186","article-title":"1.27Gb\/s\/pin 3mW\/pin wireless Superconnect (WSC) interface scheme","author":"kanda","year":"2003","journal-title":"ISSCC2003"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2005.1493970"},{"key":"1","first-page":"142","article-title":"1.2Gb\/s\/pin Wireless Superconnect Based on Inductive Inter-Chip Signaling (US)","author":"mizoguchi","year":"2004","journal-title":"ISSCC2004"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2002.1012783"},{"key":"5","first-page":"522","article-title":"3Gp\/s AC-Coupled Chip-to-Chip Communication using Low-Swing Pulse Receiver","author":"luo","year":"2005","journal-title":"ISSCC2005"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.831448"}],"event":{"name":"IEEE 2005 Custom Integrated Circuits Conference, 2005.","location":"San Jose, CA, USA"},"container-title":["Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/10489\/33245\/01568618.pdf?arnumber=1568618","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T16:57:59Z","timestamp":1489510679000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1568618\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/cicc.2005.1568618","relation":{},"subject":[]}}