{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T12:53:17Z","timestamp":1730206397096,"version":"3.28.0"},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/cicc.2005.1568756","type":"proceedings-article","created":{"date-parts":[[2006,1,18]],"date-time":"2006-01-18T23:42:54Z","timestamp":1137627774000},"page":"654-657","source":"Crossref","is-referenced-by-count":11,"title":["Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology"],"prefix":"10.1109","author":[{"given":"J.U.","family":"Knickerbocker","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.S.","family":"Patel","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.S.","family":"Andry","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.K.","family":"Tsang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"L.P.","family":"Buchwalter","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"E.","family":"Sprogis","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Hua Gan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.R.","family":"Horton","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.","family":"Polastre","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.L.","family":"Wright","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Schuster","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Baks","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.","family":"Doany","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Rosner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Cordes","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2004.835769"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2002.1175992"},{"key":"1","first-page":"121","article-title":"System-on-a-Chip: What industry needs to do","volume":"43","author":"scholten","year":"2000","journal-title":"Solid State Technol"},{"year":"0","key":"7"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1147\/rd.466.0779"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1147\/rd.425.0597"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2005.1441439"}],"event":{"name":"IEEE 2005 Custom Integrated Circuits Conference, 2005.","location":"San Jose, CA, USA"},"container-title":["Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/10489\/33245\/01568756.pdf?arnumber=1568756","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T17:51:22Z","timestamp":1489513882000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1568756\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/cicc.2005.1568756","relation":{},"subject":[]}}