{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T00:16:48Z","timestamp":1729642608446,"version":"3.28.0"},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/cicc.2005.1568757","type":"proceedings-article","created":{"date-parts":[[2006,1,18]],"date-time":"2006-01-18T18:42:54Z","timestamp":1137609774000},"page":"658-661","source":"Crossref","is-referenced-by-count":0,"title":["Three-dimensional impedance engineering for mixed-signal system-on-chip applications"],"prefix":"10.1109","author":[{"family":"Kyuchul Chong","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Xi Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"King-Ning Tu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Daquan Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Mau-Chung Frank Chang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Ya-Hong Xie","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2003.810470"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2003.810482"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/4.711344"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/16.40886"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2004.837378"},{"key":"6","doi-asserted-by":"crossref","first-page":"486","DOI":"10.1109\/TED.2003.822348","volume":"51","author":"stefanou","year":"2004","journal-title":"IEEE Trans Electron Devices"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/SOI.1996.552528"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/16.644646"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/4.668989"},{"year":"0","key":"8"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/SMIC.1998.750209"}],"event":{"name":"IEEE 2005 Custom Integrated Circuits Conference, 2005.","location":"San Jose, CA, USA"},"container-title":["Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/10489\/33245\/01568757.pdf?arnumber=1568757","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,16]],"date-time":"2017-06-16T22:30:11Z","timestamp":1497652211000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1568757\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/cicc.2005.1568757","relation":{},"subject":[]}}