{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T04:52:02Z","timestamp":1746075122120},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,9]]},"DOI":"10.1109\/cicc.2010.5617425","type":"proceedings-article","created":{"date-parts":[[2010,11,10]],"date-time":"2010-11-10T20:53:49Z","timestamp":1289422429000},"page":"1-4","source":"Crossref","is-referenced-by-count":10,"title":["Verifying electrical\/thermal\/thermo-mechanical behavior of a 3D stack - Challenges and solutions"],"prefix":"10.1109","author":[{"given":"Geert","family":"Van der Plas","sequence":"first","affiliation":[]},{"given":"Steven","family":"Thijs","sequence":"additional","affiliation":[]},{"given":"Dimitri","family":"Linten","sequence":"additional","affiliation":[]},{"given":"Guruprasad","family":"Katti","sequence":"additional","affiliation":[]},{"given":"Paresh","family":"Limaye","sequence":"additional","affiliation":[]},{"given":"Abdelkarim","family":"Mercha","sequence":"additional","affiliation":[]},{"given":"Michele","family":"Stucchi","sequence":"additional","affiliation":[]},{"given":"Herman","family":"Oprins","sequence":"additional","affiliation":[]},{"given":"Bart","family":"Vandevelde","sequence":"additional","affiliation":[]},{"given":"Nikolas","family":"Minas","sequence":"additional","affiliation":[]},{"given":"Miro","family":"Cupac","sequence":"additional","affiliation":[]},{"given":"Morin","family":"Dehan","sequence":"additional","affiliation":[]},{"given":"Marc","family":"Nelis","sequence":"additional","affiliation":[]},{"given":"Rahul","family":"Agarwal","sequence":"additional","affiliation":[]},{"given":"Wim","family":"Dehaene","sequence":"additional","affiliation":[]},{"given":"Youssef","family":"Travaly","sequence":"additional","affiliation":[]},{"given":"Eric","family":"Beyne","sequence":"additional","affiliation":[]},{"given":"Paul","family":"Marchal","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977296"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977515"},{"key":"ref10","first-page":"131","article-title":"Compact thermal modeling of hot spots in advanced 3D-stacked structures","author":"torregiani","year":"0","journal-title":"Proc of EPTC 2009"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796763"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977396"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5434016"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5073989"},{"key":"ref2","article-title":"8Gb 3D DDR3 DRAM Using Through-Silicon-Via Technology","author":"kang","year":"0","journal-title":"ISSCC 09"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2009.933437"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796821"}],"event":{"name":"2010 IEEE Custom Integrated Circuits Conference -CICC 2010","start":{"date-parts":[[2010,9,19]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2010,9,22]]}},"container-title":["IEEE Custom Integrated Circuits Conference 2010"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5605059\/5617377\/05617425.pdf?arnumber=5617425","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,19]],"date-time":"2017-03-19T03:54:37Z","timestamp":1489895677000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5617425\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,9]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/cicc.2010.5617425","relation":{},"subject":[],"published":{"date-parts":[[2010,9]]}}}