{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T20:44:39Z","timestamp":1729629879630,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,9]]},"DOI":"10.1109\/cicc.2013.6658474","type":"proceedings-article","created":{"date-parts":[[2013,11,21]],"date-time":"2013-11-21T15:50:54Z","timestamp":1385049054000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["A smartphone SP10T T\/R switch in 180-nm SOI CMOS with 8kV+ ESD protection by co-design"],"prefix":"10.1109","author":[{"given":"X. Shawn","family":"Wang","sequence":"first","affiliation":[]},{"given":"Xin","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Fei","family":"Lu","sequence":"additional","affiliation":[]},{"given":"Li","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Rui","family":"Ma","sequence":"additional","affiliation":[]},{"given":"Zongyu","family":"Dong","sequence":"additional","affiliation":[]},{"given":"Li","family":"Sun","sequence":"additional","affiliation":[]},{"given":"Albert","family":"Wang","sequence":"additional","affiliation":[]},{"given":"C. Patrick","family":"Yue","sequence":"additional","affiliation":[]},{"given":"Dawn","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Alvin","family":"Joseph","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","first-page":"58","article-title":"0.13?m\/spl mu\/m CMOS SOI SP6T antenna switch for multi-standard handsets","author":"tinella","year":"2006","journal-title":"Proc IEEE Silicon Monolithic Integrated Circuits in RF Systems"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/CSICS.2005.1531812"},{"key":"10","doi-asserted-by":"crossref","first-page":"995","DOI":"10.1109\/JSSC.2003.811978","article-title":"A mixed-mode ESD protection circuit simulation-design methodology","volume":"38","author":"feng","year":"2003","journal-title":"IEEE J Solid-State Circuits"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2003.1213998"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2012.6292089"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2255192"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2005.850652"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2012.6242253"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/4.406396"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.907201"}],"event":{"name":"2013 IEEE Custom Integrated Circuits Conference - CICC 2013","start":{"date-parts":[[2013,9,22]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2013,9,25]]}},"container-title":["Proceedings of the IEEE 2013 Custom Integrated Circuits Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6648471\/6658393\/06658474.pdf?arnumber=6658474","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,22]],"date-time":"2017-06-22T02:53:51Z","timestamp":1498100031000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6658474\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,9]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/cicc.2013.6658474","relation":{},"subject":[],"published":{"date-parts":[[2013,9]]}}}