{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T16:06:22Z","timestamp":1781798782580,"version":"3.54.5"},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,9]]},"DOI":"10.1109\/cicc.2015.7338400","type":"proceedings-article","created":{"date-parts":[[2015,11,30]],"date-time":"2015-11-30T16:52:45Z","timestamp":1448902365000},"page":"1-6","source":"Crossref","is-referenced-by-count":6,"title":["A novel low cost, high performance and reliable silicon interposer"],"prefix":"10.1109","author":[{"given":"Farhang","family":"Yazdani","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref4","first-page":"33","article-title":"Minimizing Interposer Warpage by Process Control and Design Optimization","author":"mikael","year":"0"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897534"},{"key":"ref10","first-page":"8","article-title":"European Trends in 2.5 and 3D","volume":"41","author":"von trapp","year":"2014","journal-title":"IMAPS Adv Microelectron"},{"key":"ref6","first-page":"14","article-title":"CMOS Biosensor using TSV Interposer Technology","volume":"41","author":"ebefors","year":"2014","journal-title":"IMAPS Adv Microelectron"},{"key":"ref11","article-title":"Lifting the veil on silicon interposer pricing (By Dr. Phill Garrou) – ElectroIQ","year":"0"},{"key":"ref5","first-page":"13","article-title":"Vertical through-wafer insulation: enabling integration and innovation","volume":"56","author":"himes","year":"2013","journal-title":"Solid State Technology"},{"key":"ref12","first-page":"54","article-title":"Met-Via TSV interposer as a TMV element of CMOS biosensors","volume":"18","author":"ebefors","year":"2014","journal-title":"Chip Scale Magazine"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897520"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.4071\/2014DPC-tha23"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2012.6262990"},{"key":"ref9","first-page":"298","article-title":"Pathfinding for Multiple Platforms","author":"park","year":"0"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897515"}],"event":{"name":"2015 IEEE Custom Integrated Circuits Conference - CICC 2015","location":"San Jose, CA, USA","start":{"date-parts":[[2015,9,28]]},"end":{"date-parts":[[2015,9,30]]}},"container-title":["2015 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7321938\/7338356\/07338400.pdf?arnumber=7338400","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T22:21:01Z","timestamp":1490394061000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7338400\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,9]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/cicc.2015.7338400","relation":{},"subject":[],"published":{"date-parts":[[2015,9]]}}}