{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,17]],"date-time":"2026-03-17T05:51:46Z","timestamp":1773726706151,"version":"3.50.1"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,4]]},"DOI":"10.1109\/cicc.2018.8357048","type":"proceedings-article","created":{"date-parts":[[2018,5,18]],"date-time":"2018-05-18T17:27:22Z","timestamp":1526664442000},"page":"1-4","source":"Crossref","is-referenced-by-count":32,"title":["Towards a 1.1 mm<sup>2<\/sup> free-floating wireless implantable neural recording SoC"],"prefix":"10.1109","author":[{"given":"Pyungwoo","family":"Yeon","sequence":"first","affiliation":[]},{"given":"Muhannad S.","family":"Bakir","sequence":"additional","affiliation":[]},{"given":"Maysam","family":"Ghovanloo","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.neuron.2016.06.034"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2238994"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.811979"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"11","DOI":"10.1109\/JPROC.2016.2587690","article-title":"Silicon-integrated high-density electrocortical interfaces","volume":"105","author":"ha","year":"2017","journal-title":"Proceedings of the IEEE"},{"key":"ref5","first-page":"460","article-title":"A 30.5mm3 Fully Packaged Implantable Device with Duplex Ultrasonic Data and Power Links Achieving 95kb\/s with 10-4 BER at 8.5cm depth","author":"chang","year":"2017","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3390\/mi7090154"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/BioCAS.2016.7833815"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2364824"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/BIOCAS.2017.8325214"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1088\/1741-2560\/10\/6\/066014"}],"event":{"name":"2018 IEEE Custom Integrated Circuits Conference (CICC)","location":"San Diego, CA","start":{"date-parts":[[2018,4,8]]},"end":{"date-parts":[[2018,4,11]]}},"container-title":["2018 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8355238\/8357004\/08357048.pdf?arnumber=8357048","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,6,1]],"date-time":"2018-06-01T16:13:27Z","timestamp":1527869607000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8357048\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,4]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/cicc.2018.8357048","relation":{},"subject":[],"published":{"date-parts":[[2018,4]]}}}