{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,2]],"date-time":"2026-04-02T09:13:04Z","timestamp":1775121184114,"version":"3.50.1"},"reference-count":33,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,4]]},"DOI":"10.1109\/cicc.2018.8357050","type":"proceedings-article","created":{"date-parts":[[2018,5,18]],"date-time":"2018-05-18T21:27:22Z","timestamp":1526678842000},"page":"1-8","source":"Crossref","is-referenced-by-count":29,"title":["Circuit and antenna-in-package innovations for scaled mmWave 5G phased array modules"],"prefix":"10.1109","author":[{"given":"Alberto","family":"Valdes-Garcia","sequence":"first","affiliation":[]},{"given":"Bodhisatwa","family":"Sadhu","sequence":"additional","affiliation":[]},{"given":"Xiaoxiong","family":"Gu","sequence":"additional","affiliation":[]},{"given":"Yahya","family":"Tousi","sequence":"additional","affiliation":[]},{"given":"Duixian","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Scott K.","family":"Reynolds","sequence":"additional","affiliation":[]},{"given":"Joakim","family":"Haillin","sequence":"additional","affiliation":[]},{"given":"Stefan","family":"Sahl","sequence":"additional","affiliation":[]},{"given":"Leonard","family":"Rexberg","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2017.7969019"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8059027"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2013.6569608"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2015.7081095"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSAC.2014.2328098"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2014.6736750"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1002\/9780470972946"},{"key":"ref13","first-page":"128","article-title":"A 28GHz 32-element phased-array transceiver IC with concurrent dual polarized beams and 1.4 degree beam-steering resolution for 5G communication","author":"sadhu","year":"2017","journal-title":"IEEE ISSCC"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2766211"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2013.6658442"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2016.7539968"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2016.7508326"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2016.7508273"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2006.882167"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2017.7969020"},{"key":"ref4","first-page":"184","article-title":"A silicon 60 GHz receiver and transmitter chipset for broadband communications","author":"floyd","year":"2006","journal-title":"IEEE ISSCC"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8059029"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2004.1332758"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2118110"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2623948"},{"key":"ref5","first-page":"2757","article-title":"A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60GHz Communications","author":"valdes-garcia","year":"2010","journal-title":"EEEE JSSC"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2356462"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746265"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2011.5783993"},{"key":"ref9","first-page":"342","article-title":"A 60GHz packaged switched beam 32nm CMOS TRX with broad spatial coverage, 17.1dBm peak EIRP, 6.1dB NF at < 250mW","author":"sadhu","year":"2016","journal-title":"IEEE RFIC"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.857366"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2169064"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897510"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/APS.2012.6348633"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159713"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2010.2103932"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2017.2722873"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2013.6697745"}],"event":{"name":"2018 IEEE Custom Integrated Circuits Conference (CICC)","location":"San Diego, CA","start":{"date-parts":[[2018,4,8]]},"end":{"date-parts":[[2018,4,11]]}},"container-title":["2018 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8355238\/8357004\/08357050.pdf?arnumber=8357050","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,6,1]],"date-time":"2018-06-01T20:13:11Z","timestamp":1527883991000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8357050\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,4]]},"references-count":33,"URL":"https:\/\/doi.org\/10.1109\/cicc.2018.8357050","relation":{},"subject":[],"published":{"date-parts":[[2018,4]]}}}