{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,9]],"date-time":"2026-04-09T14:27:28Z","timestamp":1775744848960,"version":"3.50.1"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,4]]},"DOI":"10.1109\/cicc.2018.8357100","type":"proceedings-article","created":{"date-parts":[[2018,5,18]],"date-time":"2018-05-18T21:27:22Z","timestamp":1526678842000},"page":"1-4","source":"Crossref","is-referenced-by-count":5,"title":["A bidirectional lens-free digital-bits-in\/-out 0.57mm<sup>2<\/sup> terahertz nano-radio in CMOS with 49.3mW Peak power consumption supporting 50cm Internet-of-Things communication"],"prefix":"10.1109","author":[{"given":"Taiyun","family":"Chi","sequence":"first","affiliation":[]},{"given":"Hechen","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Min-Yu","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Fa Foster","family":"Dai","sequence":"additional","affiliation":[]},{"given":"Hua","family":"Wang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2504930"},{"key":"ref3","first-page":"22","article-title":"A 0.38 THz fully integrated transceiver utilizing a quadrature push-push harmonic circuitry in SiGe BiCMOS","author":"park","year":"2011","journal-title":"IEEE Symp VLSI Circuits"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/APS.2016.7696501"},{"key":"ref5","first-page":"136","article-title":"A 210 GHz fully integrated differential transceiver with fundamental-frequency VCO in 32 nm SOI CMOS","author":"wang","year":"2013","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746326"},{"key":"ref7","first-page":"232","article-title":"A 12-bit vernier ring time-to-digital converter in 0.13 ?m CMOS technology","author":"yu","year":"2009","journal-title":"Proc IEEE Symp VLSI Circuits"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2384034"},{"key":"ref1","first-page":"448","article-title":"A 10mm3 syringe-implantable near-field radio system on glass substrate","author":"shi","year":"2016","journal-title":"ISSCC Dig Tech Papers"}],"event":{"name":"2018 IEEE Custom Integrated Circuits Conference (CICC)","location":"San Diego, CA","start":{"date-parts":[[2018,4,8]]},"end":{"date-parts":[[2018,4,11]]}},"container-title":["2018 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8355238\/8357004\/08357100.pdf?arnumber=8357100","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T02:18:40Z","timestamp":1643163520000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8357100\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,4]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/cicc.2018.8357100","relation":{},"subject":[],"published":{"date-parts":[[2018,4]]}}}