{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,26]],"date-time":"2026-02-26T15:47:22Z","timestamp":1772120842604,"version":"3.50.1"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,4,1]],"date-time":"2019-04-01T00:00:00Z","timestamp":1554076800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,4,1]],"date-time":"2019-04-01T00:00:00Z","timestamp":1554076800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,4,1]],"date-time":"2019-04-01T00:00:00Z","timestamp":1554076800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,4]]},"DOI":"10.1109\/cicc.2019.8780237","type":"proceedings-article","created":{"date-parts":[[2019,8,2]],"date-time":"2019-08-02T00:03:04Z","timestamp":1564704184000},"page":"1-4","source":"Crossref","is-referenced-by-count":4,"title":["A 13.6-16Gb\/s Wireline Transceiver with Dicode Encoding and Sequence Detection Decoding for Equalizing 24.2dB with 2.56pJ\/bit in 65nm CMOS"],"prefix":"10.1109","author":[{"given":"Yusang","family":"Chun","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tejasvi","family":"Anand","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2775619"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.883317"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2012.6330611"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2001934"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1973.9030"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2008.2011366"}],"event":{"name":"2019 IEEE Custom Integrated Circuits Conference (CICC)","location":"Austin, TX, USA","start":{"date-parts":[[2019,4,14]]},"end":{"date-parts":[[2019,4,17]]}},"container-title":["2019 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8767369\/8780115\/08780237.pdf?arnumber=8780237","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,18]],"date-time":"2022-07-18T14:51:20Z","timestamp":1658155880000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8780237\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,4]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/cicc.2019.8780237","relation":{},"subject":[],"published":{"date-parts":[[2019,4]]}}}