{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,11]],"date-time":"2026-03-11T16:23:13Z","timestamp":1773246193427,"version":"3.50.1"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,3]]},"DOI":"10.1109\/cicc48029.2020.9075899","type":"proceedings-article","created":{"date-parts":[[2020,4,24]],"date-time":"2020-04-24T00:53:24Z","timestamp":1587689604000},"page":"1-6","source":"Crossref","is-referenced-by-count":3,"title":["Technology Scaling of ESD Devices in State of the Art FinFET Technologies"],"prefix":"10.1109","author":[{"given":"Sukjin","family":"Kim","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Radhakrishnan","family":"Sithanandam","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Woojin","family":"Seo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mijin","family":"Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sangyoung","family":"Cho","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Juho","family":"Park","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hyukhoon","family":"Kwon","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Namho","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chanhee","family":"Jeon","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","year":"0","journal-title":"A Case for Lowering Component Level CDM ESD Specification and Requirements"},{"key":"ref3","year":"2018","journal-title":"A Case for Lowering Component Level HBM\/MM ESD Specifications and Requirements"},{"key":"ref6","article-title":"SPICE-based ESD protection design utilizing diodes and active MOSFET rail clamp circuits","author":"miller","year":"0","journal-title":"2005 EOS\/ESD Symposium Tutorial"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/6104.930960"},{"key":"ref8","article-title":"Charged Device Model Qualification Issues","year":"2012","journal-title":"Industry Council on ESD Target Levels"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/3476.739177"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2019.8780136"},{"key":"ref9","first-page":"1","article-title":"Boosted and Distributed Rail Clamp Networks for ESD Protection in Advanced CMOS Technologies","author":"michael stockinger","year":"2003","journal-title":"2003 Electrical Overstress\/Electrostatic Discharge Symposium eos\/esd"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.23919\/EOS\/ESD.2018.8509689"}],"event":{"name":"2020 IEEE Custom Integrated Circuits Conference (CICC)","location":"Boston, MA, USA","start":{"date-parts":[[2020,3,22]]},"end":{"date-parts":[[2020,3,25]]}},"container-title":["2020 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9060424\/9075871\/09075899.pdf?arnumber=9075899","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,27]],"date-time":"2022-06-27T15:40:51Z","timestamp":1656344451000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9075899\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,3]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/cicc48029.2020.9075899","relation":{},"subject":[],"published":{"date-parts":[[2020,3]]}}}