{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,28]],"date-time":"2026-01-28T21:17:23Z","timestamp":1769635043232,"version":"3.49.0"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,4,1]],"date-time":"2021-04-01T00:00:00Z","timestamp":1617235200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,4,1]],"date-time":"2021-04-01T00:00:00Z","timestamp":1617235200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,4,1]],"date-time":"2021-04-01T00:00:00Z","timestamp":1617235200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,4]]},"DOI":"10.1109\/cicc51472.2021.9431513","type":"proceedings-article","created":{"date-parts":[[2021,5,17]],"date-time":"2021-05-17T23:18:05Z","timestamp":1621293485000},"page":"1-4","source":"Crossref","is-referenced-by-count":5,"title":["3DIC Design Challenges, Early Solutions and Future Recommendations"],"prefix":"10.1109","author":[{"given":"Victoria","family":"Kolesov","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vivek","family":"Rajan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ramune","family":"Nagisetty","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","year":"0"},{"key":"ref11","year":"0"},{"key":"ref12","year":"0"},{"key":"ref13","year":"2018","journal-title":"Placement and Routing Algorithms for Sequential Chains Implementation"},{"key":"ref14","author":"venugopalan","year":"2019","journal-title":"GLOBALFOUNDRIES Digital Implementation of a 2 5D Silicon Interposer for Multi-Die Module Integration"},{"key":"ref15","author":"burke","year":"2019","journal-title":"Onwards and Upwards Xilinx Next generation multi die construction flows"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993637"},{"key":"ref17","author":"elsherbini","year":"2019","journal-title":"Heterogeneous Integration Using OmniDirectional Interconnect Packaging"},{"key":"ref18","author":"nagisetty","year":"2019","journal-title":"Intel's View of the Chiplet Revolution"},{"key":"ref4","year":"0"},{"key":"ref3","article-title":"A Look Inside The 3D Technology Toolbox For STCO","year":"0","journal-title":"by Eric Beyne IMEC"},{"key":"ref6","year":"0","journal-title":"Cadence 3DIC Design Solutions"},{"key":"ref5","year":"0","journal-title":"Synopsys 3DIC Compiler"},{"key":"ref8","year":"0"},{"key":"ref7","year":"0"},{"key":"ref2","article-title":"Process and Packaging Innovations for Moore’s Law Continuation and Beyond","year":"0","journal-title":"by Robert Chau 2019 IEEE International Electron Devices Meeting (IEDM)"},{"key":"ref1","first-page":"3","article-title":"Carbon Nanotubes for Interconnect","year":"0","journal-title":"Overview of the interconnect problem"},{"key":"ref9","year":"0"}],"event":{"name":"2021 IEEE Custom Integrated Circuits Conference (CICC)","location":"Austin, TX, USA","start":{"date-parts":[[2021,4,25]]},"end":{"date-parts":[[2021,4,30]]}},"container-title":["2021 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9431363\/9431390\/09431513.pdf?arnumber=9431513","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,9]],"date-time":"2022-07-09T02:20:37Z","timestamp":1657333237000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9431513\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,4]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/cicc51472.2021.9431513","relation":{},"subject":[],"published":{"date-parts":[[2021,4]]}}}