{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,15]],"date-time":"2025-10-15T10:32:43Z","timestamp":1760524363647},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,4]]},"DOI":"10.1109\/cicc53496.2022.9772827","type":"proceedings-article","created":{"date-parts":[[2022,5,18]],"date-time":"2022-05-18T19:37:56Z","timestamp":1652902676000},"source":"Crossref","is-referenced-by-count":13,"title":["A 112 Gb\/s -8.2 dBm Sensitivity 4-PAM Linear TIA in 16nm CMOS with Co-Packaged Photodiodes"],"prefix":"10.1109","author":[{"given":"Dhruv","family":"Patel","sequence":"first","affiliation":[{"name":"University of Toronto,Toronto,ON,Canada"}]},{"given":"Alireza","family":"Sharif-Bakhtiar","sequence":"additional","affiliation":[{"name":"Huawei Technologies,Toronto,ON,Canada"}]},{"given":"Anthony Chan","family":"Carusone","sequence":"additional","affiliation":[{"name":"University of Toronto,Toronto,ON,Canada"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2885531"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2322868"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2018.8494285"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870471"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939652"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365802"}],"event":{"name":"2022 IEEE Custom Integrated Circuits Conference (CICC)","location":"Newport Beach, CA, USA","start":{"date-parts":[[2022,4,24]]},"end":{"date-parts":[[2022,4,27]]}},"container-title":["2022 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9772767\/9772730\/09772827.pdf?arnumber=9772827","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,11,26]],"date-time":"2022-11-26T04:49:04Z","timestamp":1669438144000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9772827\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,4]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/cicc53496.2022.9772827","relation":{},"subject":[],"published":{"date-parts":[[2022,4]]}}}