{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T20:59:13Z","timestamp":1725656353810},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,4]]},"DOI":"10.1109\/cicc57935.2023.10121280","type":"proceedings-article","created":{"date-parts":[[2023,5,11]],"date-time":"2023-05-11T17:23:55Z","timestamp":1683825835000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Synchronous Die-to-Die Signaling Using Aeonic Connect"],"prefix":"10.1109","author":[{"given":"Marcus van","family":"Ierssel","sequence":"first","affiliation":[{"name":"Movellus Inc."}]},{"given":"Fred","family":"Buhler","sequence":"additional","affiliation":[{"name":"Movellus Inc."}]},{"given":"David","family":"Moore","sequence":"additional","affiliation":[{"name":"Movellus Inc."}]},{"given":"Jeffrey","family":"Fredenburg","sequence":"additional","affiliation":[{"name":"Movellus Inc."}]}],"member":"263","reference":[{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.65"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/332357.332380"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3207195"},{"key":"ref3","article-title":"What's The Difference Between CTS, Multisource CTS, And Clock Mesh?","author":"toyama","year":"2012","journal-title":"Electronicdesign com"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2747937"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365975"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/4.918917"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/2133806.2133822"}],"event":{"name":"2023 IEEE Custom Integrated Circuits Conference (CICC)","start":{"date-parts":[[2023,4,23]]},"location":"San Antonio, TX, USA","end":{"date-parts":[[2023,4,26]]}},"container-title":["2023 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10121189\/10121178\/10121280.pdf?arnumber=10121280","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,5,29]],"date-time":"2023-05-29T17:30:39Z","timestamp":1685381439000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10121280\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,4]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/cicc57935.2023.10121280","relation":{},"subject":[],"published":{"date-parts":[[2023,4]]}}}