{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,18]],"date-time":"2025-10-18T10:58:57Z","timestamp":1760785137751},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,4]]},"DOI":"10.1109\/cicc57935.2023.10121285","type":"proceedings-article","created":{"date-parts":[[2023,5,11]],"date-time":"2023-05-11T17:23:55Z","timestamp":1683825835000},"page":"1-2","source":"Crossref","is-referenced-by-count":4,"title":["A 1.54mm<sup>2<\/sup> Wake-Up Receiver Based on THz Carrier Wave and Integrated Cryptographic Authentication"],"prefix":"10.1109","author":[{"given":"Eunseok","family":"Lee","sequence":"first","affiliation":[{"name":"Massachusetts Institute of Technology,USA"}]},{"given":"Muhammad Ibrahim Wasiq","family":"Khan","sequence":"additional","affiliation":[{"name":"Massachusetts Institute of Technology,USA"}]},{"given":"Xibi","family":"Chen","sequence":"additional","affiliation":[{"name":"Massachusetts Institute of Technology,USA"}]},{"given":"Utsav","family":"Banerjee","sequence":"additional","affiliation":[{"name":"Indian Institute of Science,India"}]},{"given":"Nathan","family":"Monroe","sequence":"additional","affiliation":[{"name":"Massachusetts Institute of Technology,USA"}]},{"given":"Rabia Tugce","family":"Yazicigil","sequence":"additional","affiliation":[{"name":"Boston University,USA"}]},{"given":"Ruonan","family":"Han","sequence":"additional","affiliation":[{"name":"Massachusetts Institute of Technology,USA"}]},{"given":"Anantha P.","family":"Chandrakasan","sequence":"additional","affiliation":[{"name":"Massachusetts Institute of Technology,USA"}]}],"member":"263","reference":[{"journal-title":"ISSCC","year":"2022","author":"monroe","key":"ref8"},{"journal-title":"RFIC","year":"0","author":"khan","key":"ref7"},{"journal-title":"IMS","year":"2017","author":"dadash","key":"ref4"},{"journal-title":"RFIC","year":"2017","author":"sadagopan","key":"ref3"},{"journal-title":"VLSI","year":"2016","author":"lim","key":"ref6"},{"journal-title":"ISSCC","year":"2018","author":"rekhi","key":"ref5"},{"journal-title":"JSSC","year":"2022","author":"garay","key":"ref2"},{"journal-title":"ISSCC","year":"2009","author":"casanova","key":"ref1"}],"event":{"name":"2023 IEEE Custom Integrated Circuits Conference (CICC)","start":{"date-parts":[[2023,4,23]]},"location":"San Antonio, TX, USA","end":{"date-parts":[[2023,4,26]]}},"container-title":["2023 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10121189\/10121178\/10121285.pdf?arnumber=10121285","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,12]],"date-time":"2023-06-12T17:51:34Z","timestamp":1686592294000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10121285\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,4]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/cicc57935.2023.10121285","relation":{},"subject":[],"published":{"date-parts":[[2023,4]]}}}