{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,2]],"date-time":"2026-07-02T05:30:59Z","timestamp":1782970259092,"version":"3.54.5"},"reference-count":4,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,21]],"date-time":"2024-04-21T00:00:00Z","timestamp":1713657600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,21]],"date-time":"2024-04-21T00:00:00Z","timestamp":1713657600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["92164301,62225401"],"award-info":[{"award-number":["92164301,62225401"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100013314","name":"111 project","doi-asserted-by":"publisher","award":["818001"],"award-info":[{"award-number":["818001"]}],"id":[{"id":"10.13039\/501100013314","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,21]]},"DOI":"10.1109\/cicc60959.2024.10529046","type":"proceedings-article","created":{"date-parts":[[2024,5,15]],"date-time":"2024-05-15T17:33:58Z","timestamp":1715794438000},"page":"1-2","source":"Crossref","is-referenced-by-count":11,"title":["S2D-CIM: A 22nm 128Kb Systolic Digital Compute-in-Memory Macro with Domino Data Path for Flexible Vector Operation and 2-D Weight Update in Edge AI Applications"],"prefix":"10.1109","author":[{"given":"Meng","family":"Wu","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wenjie","family":"Ren","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Peiyu","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wentao","family":"Zhao","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yiqi","family":"Jing","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiayoon","family":"Ru","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhixuan","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yufei","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ru","family":"Huang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tianyu","family":"Jia","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Le","family":"Ye","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"ISSCC","author":"Yan","year":"2022"},{"key":"ref2","volume-title":"ISSCC","author":"Guo","year":"2023"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/0167-9260(89)90063-1"},{"key":"ref4","volume-title":"ISSCC","author":"Mori","year":"2023"}],"event":{"name":"2024 IEEE Custom Integrated Circuits Conference (CICC)","location":"Denver, CO, USA","start":{"date-parts":[[2024,4,21]]},"end":{"date-parts":[[2024,4,24]]}},"container-title":["2024 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10528947\/10528954\/10529046.pdf?arnumber=10529046","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T17:21:42Z","timestamp":1715880102000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529046\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,21]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/cicc60959.2024.10529046","relation":{},"subject":[],"published":{"date-parts":[[2024,4,21]]}}}