{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T17:29:40Z","timestamp":1772645380927,"version":"3.50.1"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,21]],"date-time":"2024-04-21T00:00:00Z","timestamp":1713657600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,21]],"date-time":"2024-04-21T00:00:00Z","timestamp":1713657600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62235009,62374039"],"award-info":[{"award-number":["62235009,62374039"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2021YFA1200700"],"award-info":[{"award-number":["2021YFA1200700"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,21]]},"DOI":"10.1109\/cicc60959.2024.10529051","type":"proceedings-article","created":{"date-parts":[[2024,5,15]],"date-time":"2024-05-15T17:33:58Z","timestamp":1715794438000},"page":"1-2","source":"Crossref","is-referenced-by-count":5,"title":["A 32\u00d732 Flash LiDAR SPAD Sensor with Up-to-1kfps Motional Target Detection by Threshold-adaptive 2D Dynamic Vision"],"prefix":"10.1109","author":[{"given":"Jingyi","family":"Wang","sequence":"first","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Zhangcheng","family":"Huang","sequence":"additional","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Bu","family":"Chen","sequence":"additional","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Hongyang","family":"Shang","sequence":"additional","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Jiapei","family":"Zheng","sequence":"additional","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Hankun","family":"Lv","sequence":"additional","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Chixiao","family":"Chen","sequence":"additional","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Qi","family":"Liu","sequence":"additional","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]},{"given":"Ming","family":"Liu","sequence":"additional","affiliation":[{"name":"Frontier Institute of Chip and System, Fudan University,State Key Lab of Integrated Chips and Systems,Shanghai,China"}]}],"member":"263","reference":[{"key":"ref1","first-page":"96","article-title":"A 64 \u00d7 64-Pixel Flash LiDAR SPAD Imager with Distributed Pixel-to-Pixel Correlation for Background Rejection, Tunable Automatic Pixel Sensitivity and First-Last Event Detection Strategies for Space Applications","author":"Manuzzato","year":"2022","journal-title":"IEEE ISSCC"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2993722"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/jstqe.2023.3238520"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3292051"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067566"}],"event":{"name":"2024 IEEE Custom Integrated Circuits Conference (CICC)","location":"Denver, CO, USA","start":{"date-parts":[[2024,4,21]]},"end":{"date-parts":[[2024,4,24]]}},"container-title":["2024 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10528947\/10528954\/10529051.pdf?arnumber=10529051","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T05:08:17Z","timestamp":1715836097000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529051\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,21]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/cicc60959.2024.10529051","relation":{},"subject":[],"published":{"date-parts":[[2024,4,21]]}}}