{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T04:05:52Z","timestamp":1747800352137,"version":"3.41.0"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,4,13]],"date-time":"2025-04-13T00:00:00Z","timestamp":1744502400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,13]],"date-time":"2025-04-13T00:00:00Z","timestamp":1744502400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key R&D Program of China","doi-asserted-by":"publisher","award":["2020yfb1807300"],"award-info":[{"award-number":["2020yfb1807300"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62131013"],"award-info":[{"award-number":["62131013"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,4,13]]},"DOI":"10.1109\/cicc63670.2025.10983173","type":"proceedings-article","created":{"date-parts":[[2025,5,19]],"date-time":"2025-05-19T17:52:03Z","timestamp":1747677123000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["A 104-to-132 GHz 16-way Power Amplifier Using Enhanced Magnetic Coupling Cavity Achieving 21.2 dBm Output Power in 28nm Bulk CMOS"],"prefix":"10.1109","author":[{"given":"Ziyuan","family":"Guo","sequence":"first","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Wei","family":"Deng","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Weiqi","family":"Zheng","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Haikun","family":"Jia","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Hongliang","family":"Wu","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Qiuyu","family":"Peng","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Fuyuan","family":"Zhao","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Junyang","family":"Yin","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Dongze","family":"Li","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]},{"given":"Baoyong","family":"Chi","sequence":"additional","affiliation":[{"name":"Tsinghua University,Beijing,China"}]}],"member":"263","reference":[{"key":"ref1","article-title":"A 640-Gb\/s 4\u00d74 -MIMO D-Band CMOS Transceiver Chipset","author":"Liu","year":"2024","journal-title":"VLSI"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731637"},{"issue":"5","key":"ref3","volume":"57","author":"Li","year":"2022","journal-title":"High Efficiency D-Band Multiway Power Combined Amplifiers With 17.5-19-dBm Psat and 14.2-12.1% Peak PAE in 45-nm CMOS RFSOI"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2018.2865460"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/rfic61187.2024.10600010"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2022.3202814"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454268"},{"key":"ref8","article-title":"24.7 A 15dBm 12.8%-PAE Compact D-Band Power Amplifier with Two-Way Power Combining in 16nm FinFET CMOS","author":"Philippe","year":"2020","journal-title":"ISSCC"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/tmtt.2022.3231599"}],"event":{"name":"2025 IEEE Custom Integrated Circuits Conference (CICC)","start":{"date-parts":[[2025,4,13]]},"location":"Boston, MA, USA","end":{"date-parts":[[2025,4,17]]}},"container-title":["2025 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10982532\/10982698\/10983173.pdf?arnumber=10983173","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,20]],"date-time":"2025-05-20T09:41:51Z","timestamp":1747734111000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10983173\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4,13]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/cicc63670.2025.10983173","relation":{},"subject":[],"published":{"date-parts":[[2025,4,13]]}}}