{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T04:11:31Z","timestamp":1751343091482,"version":"3.41.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,4,13]],"date-time":"2025-04-13T00:00:00Z","timestamp":1744502400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,13]],"date-time":"2025-04-13T00:00:00Z","timestamp":1744502400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["24H00073,JPMJCR19K5,62274081,2023QN10X177"],"award-info":[{"award-number":["24H00073,JPMJCR19K5,62274081,2023QN10X177"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,4,13]]},"DOI":"10.1109\/cicc63670.2025.10983627","type":"proceedings-article","created":{"date-parts":[[2025,5,19]],"date-time":"2025-05-19T17:52:03Z","timestamp":1747677123000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["A 22nm Resource-Frugal Hyper-Heterogeneous Multi-Modal System-on-Chip Towards In-Orbit Computing"],"prefix":"10.1109","author":[{"given":"Quan","family":"Cheng","sequence":"first","affiliation":[{"name":"Kyoto University,Kyoto,Japan"}]},{"given":"Qiufeng","family":"Li","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}]},{"given":"Weirong","family":"Dong","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}]},{"given":"Mingtao","family":"Zhang","sequence":"additional","affiliation":[{"name":"Kyoto University,Kyoto,Japan"}]},{"given":"Ruilin","family":"Zhang","sequence":"additional","affiliation":[{"name":"Kyoto University,Kyoto,Japan"}]},{"given":"Mingqiang","family":"Huang","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}]},{"given":"Hao","family":"Yu","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}]},{"given":"Yiyu","family":"Shi","sequence":"additional","affiliation":[{"name":"University of Notre Dame,USA"}]},{"given":"Hiromitsu","family":"Awano","sequence":"additional","affiliation":[{"name":"Kyoto University,Kyoto,Japan"}]},{"given":"Takashi","family":"Sato","sequence":"additional","affiliation":[{"name":"Kyoto University,Kyoto,Japan"}]},{"given":"Longyang","family":"Lin","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}]},{"given":"Masanori","family":"Hashimoto","sequence":"additional","affiliation":[{"name":"Kyoto University,Kyoto,Japan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/maes.2020.3008468"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/lca.2019.2907539"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2022.3140241"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067643"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/radecs.2001.1159256"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365745"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/icecs58634.2023.10382727"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tgrs.2023.3258666"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2021.3129114"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/tns.2004.839135"}],"event":{"name":"2025 IEEE Custom Integrated Circuits Conference (CICC)","start":{"date-parts":[[2025,4,13]]},"location":"Boston, MA, USA","end":{"date-parts":[[2025,4,17]]}},"container-title":["2025 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10982532\/10982698\/10983627.pdf?arnumber=10983627","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,30]],"date-time":"2025-06-30T17:35:36Z","timestamp":1751304936000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10983627\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4,13]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/cicc63670.2025.10983627","relation":{},"subject":[],"published":{"date-parts":[[2025,4,13]]}}}