{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,12]],"date-time":"2026-05-12T16:56:22Z","timestamp":1778604982977,"version":"3.51.4"},"reference-count":20,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,4,13]],"date-time":"2025-04-13T00:00:00Z","timestamp":1744502400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,13]],"date-time":"2025-04-13T00:00:00Z","timestamp":1744502400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["92164104"],"award-info":[{"award-number":["92164104"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,4,13]]},"DOI":"10.1109\/cicc63670.2025.10983717","type":"proceedings-article","created":{"date-parts":[[2025,5,19]],"date-time":"2025-05-19T13:52:03Z","timestamp":1747662723000},"page":"1-3","source":"Crossref","is-referenced-by-count":1,"title":["A Fractional-N Cascaded PLL Employing the Calibration-Free Noise-and-Spur Cancellation Technique"],"prefix":"10.1109","author":[{"given":"Yongqi","family":"Hu","sequence":"first","affiliation":[{"name":"Shanghaitech University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jue","family":"Huang","sequence":"additional","affiliation":[{"name":"Shanghaitech University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chenkang","family":"Ning","sequence":"additional","affiliation":[{"name":"Shanghaitech University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yumeng","family":"Yuan","sequence":"additional","affiliation":[{"name":"Shanghaitech University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Xu","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Na","family":"Yan","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xufeng","family":"Kou","sequence":"additional","affiliation":[{"name":"Shanghaitech University,Shanghai,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2529004"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC49505.2020.9218347"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731676"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3321837"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3209614"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662494"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/tmtt.2016.2647698"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3383605"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2686838"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2511157"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2017.2768411"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2918940"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2017.2734910"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731646"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310349"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2951384"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2478449"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2017.2788876"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3072344"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3263075"}],"event":{"name":"2025 IEEE Custom Integrated Circuits Conference (CICC)","location":"Boston, MA, USA","start":{"date-parts":[[2025,4,13]]},"end":{"date-parts":[[2025,4,17]]}},"container-title":["2025 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10982532\/10982698\/10983717.pdf?arnumber=10983717","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,18]],"date-time":"2025-07-18T17:42:05Z","timestamp":1752860525000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10983717\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4,13]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/cicc63670.2025.10983717","relation":{},"subject":[],"published":{"date-parts":[[2025,4,13]]}}}