{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,27]],"date-time":"2026-05-27T07:03:20Z","timestamp":1779865400574,"version":"3.53.1"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,19]],"date-time":"2026-04-19T00:00:00Z","timestamp":1776556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,19]],"date-time":"2026-04-19T00:00:00Z","timestamp":1776556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100020487","name":"Nature","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100020487","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,19]]},"DOI":"10.1109\/cicc65509.2026.11509466","type":"proceedings-article","created":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T02:52:39Z","timestamp":1778813559000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["A 0.65V 10-to-21.5GHz Time-amplifying-based Sampling PLL Achieving 41.3-67.3fs jitter and -255dB Peak FoM\n                    <sub>T<\/sub>"],"prefix":"10.1109","author":[{"given":"Depeng","family":"Sun","sequence":"first","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanzhe","family":"Zhu","sequence":"additional","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dingtao","family":"Zeng","sequence":"additional","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuan","family":"Gao","sequence":"additional","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Feng","family":"Bu","sequence":"additional","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bowen","family":"Wang","sequence":"additional","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hao","family":"Xu","sequence":"additional","affiliation":[{"name":"Fudan University,Institute of Microelectronics,Shanghai,China,200433"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Na","family":"Yan","sequence":"additional","affiliation":[{"name":"Fudan University,Institute of Microelectronics,Shanghai,China,200433"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ruixue","family":"Ding","sequence":"additional","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shubin","family":"Liu","sequence":"additional","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhangming","family":"Zhu","sequence":"additional","affiliation":[{"name":"Xidian University,Hangzhou Institute of Technology,Hangzhou,China,311231"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2020.2967562"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067638"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/CICC63670.2025.10983379"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3225105"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3033271"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2899726"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49661.2025.10904662"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2023.3269572"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2024.3368190"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3242617"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310342"}],"event":{"name":"2026 IEEE Custom Integrated Circuits Conference (CICC)","location":"Seattle, WA, USA","start":{"date-parts":[[2026,4,19]]},"end":{"date-parts":[[2026,4,23]]}},"container-title":["2026 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11509458\/11509459\/11509466.pdf?arnumber=11509466","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,5,27]],"date-time":"2026-05-27T06:15:27Z","timestamp":1779862527000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11509466\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,19]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/cicc65509.2026.11509466","relation":{},"subject":[],"published":{"date-parts":[[2026,4,19]]}}}