{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,9]],"date-time":"2026-06-09T07:01:10Z","timestamp":1780988470815,"version":"3.54.1"},"reference-count":20,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,19]],"date-time":"2026-04-19T00:00:00Z","timestamp":1776556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,19]],"date-time":"2026-04-19T00:00:00Z","timestamp":1776556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,19]]},"DOI":"10.1109\/cicc65509.2026.11509478","type":"proceedings-article","created":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T02:52:39Z","timestamp":1778813559000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["A 1nJ\u2022mmHg\n                    <sup>2<\/sup>\n                    RDC Using a Double-Settling RC Bridge and a Common-Mode Cancelling Series-Parallel Amplifier for Implantable Pressure and Strain Monitoring"],"prefix":"10.1109","author":[{"given":"Tim","family":"Keller","sequence":"first","affiliation":[{"name":"ETH Zurich,Zurich,Switzerland,8092"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Arturo di","family":"Girolamo","sequence":"additional","affiliation":[{"name":"ETH Zurich,Zurich,Switzerland,8092"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yiyang","family":"Chen","sequence":"additional","affiliation":[{"name":"ETH Zurich,Zurich,Switzerland,8092"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hesam","family":"Ghiasi","sequence":"additional","affiliation":[{"name":"ETH Zurich,Zurich,Switzerland,8092"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Donguk","family":"Seo","sequence":"additional","affiliation":[{"name":"Sungkyunkwan University,Suwon,South Korea,16419"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yoonmyung","family":"Lee","sequence":"additional","affiliation":[{"name":"Sungkyunkwan University,Suwon,South Korea,16419"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Taekwang","family":"Jang","sequence":"additional","affiliation":[{"name":"ETH Zurich,Zurich,Switzerland,8092"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2010.2041058"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/medicina58070858"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.5213\/inj.2015.19.3.133"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.5005\/jp-journals-10008-1118"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2869595"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662337"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3018164"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3286796"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870408"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310317"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2022.3187828"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2017.8008520"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/VLSICircuits18222.2020.9162778"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/CICC51472.2021.9431533"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2782086"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46783.2024.10631410"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2021.3107899"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/lssc.2020.3029016"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2778277"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3235521"}],"event":{"name":"2026 IEEE Custom Integrated Circuits Conference (CICC)","location":"Seattle, WA, USA","start":{"date-parts":[[2026,4,19]]},"end":{"date-parts":[[2026,4,23]]}},"container-title":["2026 IEEE Custom Integrated Circuits Conference (CICC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11509458\/11509459\/11509478.pdf?arnumber=11509478","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,9]],"date-time":"2026-06-09T06:12:09Z","timestamp":1780985529000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11509478\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,19]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/cicc65509.2026.11509478","relation":{},"subject":[],"published":{"date-parts":[[2026,4,19]]}}}