{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,4]],"date-time":"2025-12-04T10:09:42Z","timestamp":1764842982199,"version":"3.38.0"},"reference-count":22,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,26]],"date-time":"2024-10-26T00:00:00Z","timestamp":1729900800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,26]],"date-time":"2024-10-26T00:00:00Z","timestamp":1729900800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001810","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62073195"],"award-info":[{"award-number":["62073195"]}],"id":[{"id":"10.13039\/501100001810","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,26]]},"DOI":"10.1109\/cisp-bmei64163.2024.10906077","type":"proceedings-article","created":{"date-parts":[[2025,3,7]],"date-time":"2025-03-07T18:33:21Z","timestamp":1741372401000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["A 3-DOFs Haptic Feedback Device Equipped Upon Fingertips"],"prefix":"10.1109","author":[{"given":"Mengqi","family":"Liu","sequence":"first","affiliation":[{"name":"Institute of Intelligent Medial Engineering, School of Control Science and Engineering, Shandong University,Laboratory of Rehabilitation Engineering,Jinan,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yafei","family":"Guo","sequence":"additional","affiliation":[{"name":"Imperial College London,Department of Life Science"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ke","family":"Li","sequence":"additional","affiliation":[{"name":"Institute of Intelligent Medial Engineering, School of Control Science and Engineering, Shandong University,Laboratory of Rehabilitation Engineering,Jinan,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202007428"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1146\/annurev-control-060117-105043"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1088\/1742-6596\/1650\/3\/032138"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/86.788473"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/icra.2014.6907419"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-01848-5_13"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.4108\/eai.25-4-2016.151165"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-07464-1_1"},{"key":"ref9","first-page":"93","article-title":"Haptic interfaces","volume-title":"Handbook of Virtual Environments","author":"Biggs","year":"2002"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ROBOT.1994.351077"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TOH.2012.15"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/HAPTIC.2002.998949"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1038\/nrn2621"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/WHC.2005.116"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/WHC.2007.15"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/HAPTICS.2014.6775473"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.euromechsol.2004.12.003"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1080\/11762320902920575"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1197\/j.jht.2007.07.020"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/HAPTICS.2016.7463168"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TOH.2017.2755015"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/HAPTIC.2010.5444667"}],"event":{"name":"2024 17th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI)","start":{"date-parts":[[2024,10,26]]},"location":"Shanghai, China","end":{"date-parts":[[2024,10,28]]}},"container-title":["2024 17th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10906074\/10906075\/10906077.pdf?arnumber=10906077","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,8]],"date-time":"2025-03-08T08:06:34Z","timestamp":1741421194000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10906077\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,26]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/cisp-bmei64163.2024.10906077","relation":{},"subject":[],"published":{"date-parts":[[2024,10,26]]}}}