{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,30]],"date-time":"2026-01-30T22:52:43Z","timestamp":1769813563970,"version":"3.49.0"},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,8]]},"DOI":"10.1109\/coase.2010.5584102","type":"proceedings-article","created":{"date-parts":[[2010,9,29]],"date-time":"2010-09-29T14:03:24Z","timestamp":1285769004000},"source":"Crossref","is-referenced-by-count":2,"title":["Wafer-level inspection system for the automated testing of comb drive based MEMS sensors and actuators"],"prefix":"10.1109","author":[{"given":"F","family":"Beyeler","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S","family":"Muntwyler","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"B J","family":"Nelson","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","year":"0","journal-title":"Polytec Micro Motion Analyzer MMA-300 Polytec GmbH"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/17\/12\/006"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2006.885853"},{"key":"ref13","year":"0","journal-title":"FemtoTools GmbH"},{"key":"ref14","article-title":"Investigation of mechanical properties of soft hydrogel microcapsules in relation to protein delivery using a MEMS force sensor","author":"kim","year":"2009","journal-title":"J of Biomedical Materials Research Part A published on line"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(03)00295-4"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2006.03.001"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2005.07.088"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.optcom.2006.03.008"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2006.07.091"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2006.10.014"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1078\/0030-4026-00564"},{"key":"ref2","first-page":"232","article-title":"Wafer level and substrate chip scale packaging","author":"james","year":"1999","journal-title":"IEEE International Symposium on Advanced Packaging"},{"key":"ref1","article-title":"System on Chip Test Architectures","author":"ramadoss","year":"2008"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.optlaseng.2008.09.006"}],"event":{"name":"2010 IEEE International Conference on Automation Science and Engineering (CASE 2010)","location":"Toronto, ON","start":{"date-parts":[[2010,8,21]]},"end":{"date-parts":[[2010,8,24]]}},"container-title":["2010 IEEE International Conference on Automation Science and Engineering"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5570123\/5583939\/05584102.pdf?arnumber=5584102","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,19]],"date-time":"2017-03-19T02:04:07Z","timestamp":1489889047000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5584102\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,8]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/coase.2010.5584102","relation":{},"subject":[],"published":{"date-parts":[[2010,8]]}}}