{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,2]],"date-time":"2025-09-02T00:04:10Z","timestamp":1756771450162,"version":"3.44.0"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/comcomap46287.2019.9018835","type":"proceedings-article","created":{"date-parts":[[2020,3,2]],"date-time":"2020-03-02T23:31:21Z","timestamp":1583191881000},"page":"365-368","source":"Crossref","is-referenced-by-count":0,"title":["Substrate Integrated Suspended Line (SISL) to Substrate Integrated Waveguide (SIW) Interconnect at 28 GHz Band"],"prefix":"10.1109","author":[{"given":"Leijia","family":"Xu","sequence":"first","affiliation":[{"name":"Harbin Institute of Technology,Shenzhen,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zihao","family":"Chen","sequence":"additional","affiliation":[{"name":"Harbin Institute of Technology,Shenzhen,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2845363"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2018.2883565"},{"key":"ref10","article-title":"Substrate Integrated Waveguide (SIW) to Microstrip Transition at X-Band","author":"imran nawaz","year":"2014","journal-title":"International Conference on Circuits Systems and Control"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2016.2562631"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8058673"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2892732"},{"key":"ref8","article-title":"A Novel Low-Cost Kaband Transition from Conventional Waveguide to Substrate Integrated Suspended Waveguide","author":"xu","year":"2018","journal-title":"IEEE\/MTT-S International Microwave Symposium"},{"key":"ref7","article-title":"A Ka-Band Substrate Integrated Suspended Line to Rectangular Waveguide Transition","volume":"28","author":"ma","year":"2018","journal-title":"IEEE Microwave and Wireless Components Letters"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2018.2842300"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2766625"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439141"}],"event":{"name":"2019 Computing, Communications and IoT Applications (ComComAp)","start":{"date-parts":[[2019,10,26]]},"location":"Shenzhen, China","end":{"date-parts":[[2019,10,28]]}},"container-title":["2019 Computing, Communications and IoT Applications (ComComAp)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8989918\/9018635\/09018835.pdf?arnumber=9018835","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T19:25:59Z","timestamp":1756754759000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9018835\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/comcomap46287.2019.9018835","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}