{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T19:57:43Z","timestamp":1725393463269},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,4]]},"DOI":"10.1109\/coolchips.2011.5890917","type":"proceedings-article","created":{"date-parts":[[2011,6,20]],"date-time":"2011-06-20T21:08:15Z","timestamp":1308604095000},"page":"1-3","source":"Crossref","is-referenced-by-count":3,"title":["FlexGrip™: A small and high-performance programmable hardware for highly sequential application"],"prefix":"10.1109","author":[{"given":"Takashi","family":"Yoshikawa","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fumihiko","family":"Hyuga","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Masayuki","family":"Tokunaga","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yutaka","family":"Yamada","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shigehiro","family":"Asano","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"222","article-title":"Entropy coding on a programmable processor array for multimedia SOC","author":"roberto","year":"2007","journal-title":"IEEE Int Conf on Application-specific Systems Architectures and Processros (ASAP)"},{"journal-title":"SiliconHive's White Paper","article-title":"Hive Flex VSP2000 series: A Scalable & Flexible Video Signal Processor for Coding\/Decoding and Pre-\/Post-Processing Applications","year":"2007","key":"ref3"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796534"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2005.35"}],"event":{"name":"2011 IEEE Cool Chips XIV","start":{"date-parts":[[2011,4,20]]},"location":"Yokohama, Japan","end":{"date-parts":[[2011,4,22]]}},"container-title":["2011 IEEE Cool Chips XIV"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5871805\/5890901\/05890917.pdf?arnumber=5890917","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T09:52:37Z","timestamp":1490089957000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5890917\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,4]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/coolchips.2011.5890917","relation":{},"subject":[],"published":{"date-parts":[[2011,4]]}}}