{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T13:51:38Z","timestamp":1730209898836,"version":"3.28.0"},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,4]]},"DOI":"10.1109\/coolchips.2012.6216584","type":"proceedings-article","created":{"date-parts":[[2012,6,21]],"date-time":"2012-06-21T08:18:10Z","timestamp":1340266690000},"page":"1-3","source":"Crossref","is-referenced-by-count":6,"title":["Cool System scalable 3-D stacked heterogeneous Multi-Core \/ Multi-Chip architecture for ultra low-power digital TV applications"],"prefix":"10.1109","author":[{"given":"Yukoh","family":"Matsumoto","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tomoyuki","family":"Morimoto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michiya","family":"Hagimoto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroyuki","family":"Uchida","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nobuyuki","family":"Hikichi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fumito","family":"Imura","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroshi","family":"Nakagawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Masahiro","family":"Aoyagi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","article-title":"Flip-chip interconnection by nanoparticle deposited cone-bumps for heterogeneous multi-chip-stacking cool systems","author":"imura","year":"2011","journal-title":"Proc Int Conf Electron Packag (ICEP)"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/COOLCHIPS.2011.5890921"},{"key":"1","first-page":"205","article-title":"Conservation cores: Reducing the energy ofmature computations","author":"venkatesh","year":"0","journal-title":"Proceedings of the fifteenth edition of ASPLOS on Architectural support for programming languages and operating systems - ASPLOS '10"},{"key":"5","article-title":"Scalable multi-core SoC platform for low-powered architecture","volume":"10","author":"matsumoto","year":"2007","journal-title":"Proc of Cool Chips"},{"key":"4","article-title":"Development of a heterogeneous multi-chip stacked COOL system for energy-saving embedded systems","volume":"2010 emb 19","author":"matsumoto","year":"0","journal-title":"Information Processing Society of Japan"}],"event":{"name":"2012 IEEE Cool Chips XV","start":{"date-parts":[[2012,4,18]]},"location":"Yokohama, Japan","end":{"date-parts":[[2012,4,20]]}},"container-title":["2012 IEEE COOL Chips XV"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6210529\/6216568\/06216584.pdf?arnumber=6216584","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T12:44:08Z","timestamp":1490100248000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6216584\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,4]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/coolchips.2012.6216584","relation":{},"subject":[],"published":{"date-parts":[[2012,4]]}}}